Failure mechanism analysis of fuses subjected to manufacturing and operational thermal stresses

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

1 Citation (Scopus)
10 Downloads (Pure)

Resumé

This paper identifies failure mechanisms of axial lead fuses subjected to real field ambient thermal profiles by finite element simulations and experimental testing. Experimental observation of failed fuses attributes fatigue failure of fuses to breakage of the fuse element. The fuse elements consistently fail at the notches adjacent to the end caps accompanied by a localized out-of-plane bend. Identification of the failure mechanism motivates a comprehensive thermo-mechanical study of the fuse deformation response prior to failure, which is rather involved due to the complex interactions of the fuse components, and residual effects of manufacturing processes. An investigation on the pre-operational state of fuses evaluates damage introduced during manufacturing of the fuse. In specific, the work simulates soldering induced residual stresses and addresses their impact on the fatigue damage and lifetime of the fuse. In the paper a lifetime model of the fuse is proposed and tested.
OriginalsprogEngelsk
TidsskriftMicroelectronics Reliability
Vol/bind88-90
Sider (fra-til)304-308
Antal sider5
ISSN0026-2714
DOI
StatusUdgivet - sep. 2018
Begivenhed29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Danmark
Varighed: 1 okt. 20185 okt. 2018
Konferencens nummer: 29th
http://www.esref2018conf.org/

Konference

Konference29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Nummer29th
LokationAKKC
LandDanmark
ByAalborg
Periode01/10/201805/10/2018
Internetadresse

Fingerprint

fuses
Electric fuses
thermal stresses
Thermal stress
manufacturing
damage
life (durability)
soldering
Soldering
Fatigue damage
notches
caps
residual stress
Residual stresses
Lead
Fatigue of materials

Citer dette

@inproceedings{00be2b20332a400ab97ad1b3caaeed42,
title = "Failure mechanism analysis of fuses subjected to manufacturing and operational thermal stresses",
abstract = "This paper identifies failure mechanisms of axial lead fuses subjected to real field ambient thermal profiles by finite element simulations and experimental testing. Experimental observation of failed fuses attributes fatigue failure of fuses to breakage of the fuse element. The fuse elements consistently fail at the notches adjacent to the end caps accompanied by a localized out-of-plane bend. Identification of the failure mechanism motivates a comprehensive thermo-mechanical study of the fuse deformation response prior to failure, which is rather involved due to the complex interactions of the fuse components, and residual effects of manufacturing processes. An investigation on the pre-operational state of fuses evaluates damage introduced during manufacturing of the fuse. In specific, the work simulates soldering induced residual stresses and addresses their impact on the fatigue damage and lifetime of the fuse. In the paper a lifetime model of the fuse is proposed and tested.",
author = "Bahman, {A. S.} and Jensen, {S. M.} and F. Iannuzzo",
year = "2018",
month = "9",
doi = "10.1016/j.microrel.2018.06.108",
language = "English",
volume = "88-90",
pages = "304--308",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Pergamon Press",

}

Failure mechanism analysis of fuses subjected to manufacturing and operational thermal stresses. / Bahman, A. S.; Jensen, S. M.; Iannuzzo, F.

I: Microelectronics Reliability, Bind 88-90, 09.2018, s. 304-308.

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

TY - GEN

T1 - Failure mechanism analysis of fuses subjected to manufacturing and operational thermal stresses

AU - Bahman, A. S.

AU - Jensen, S. M.

AU - Iannuzzo, F.

PY - 2018/9

Y1 - 2018/9

N2 - This paper identifies failure mechanisms of axial lead fuses subjected to real field ambient thermal profiles by finite element simulations and experimental testing. Experimental observation of failed fuses attributes fatigue failure of fuses to breakage of the fuse element. The fuse elements consistently fail at the notches adjacent to the end caps accompanied by a localized out-of-plane bend. Identification of the failure mechanism motivates a comprehensive thermo-mechanical study of the fuse deformation response prior to failure, which is rather involved due to the complex interactions of the fuse components, and residual effects of manufacturing processes. An investigation on the pre-operational state of fuses evaluates damage introduced during manufacturing of the fuse. In specific, the work simulates soldering induced residual stresses and addresses their impact on the fatigue damage and lifetime of the fuse. In the paper a lifetime model of the fuse is proposed and tested.

AB - This paper identifies failure mechanisms of axial lead fuses subjected to real field ambient thermal profiles by finite element simulations and experimental testing. Experimental observation of failed fuses attributes fatigue failure of fuses to breakage of the fuse element. The fuse elements consistently fail at the notches adjacent to the end caps accompanied by a localized out-of-plane bend. Identification of the failure mechanism motivates a comprehensive thermo-mechanical study of the fuse deformation response prior to failure, which is rather involved due to the complex interactions of the fuse components, and residual effects of manufacturing processes. An investigation on the pre-operational state of fuses evaluates damage introduced during manufacturing of the fuse. In specific, the work simulates soldering induced residual stresses and addresses their impact on the fatigue damage and lifetime of the fuse. In the paper a lifetime model of the fuse is proposed and tested.

UR - http://www.scopus.com/inward/record.url?scp=85049326038&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2018.06.108

DO - 10.1016/j.microrel.2018.06.108

M3 - Conference article in Journal

VL - 88-90

SP - 304

EP - 308

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

ER -