FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

285 Downloads (Pure)

Resumé

Thermal management of high power IGBT (Insulated Gate Bipolar Transistor) modules is crucial to ensure the reliable operation of power electronic systems especially in wind power applications. The important stage in thermal management of power modules is temperature estimation inside the IGBT modules. Generally, thermal information on datasheet is used to estimate transistor and diode chip temperatures, but this information is based on average and rough temperature measurements. In addition this information does not consider thermal coupling impact between the chips and the impact of different cooling conditions on thermal behavior of power module. In this paper, a detailed 3D thermal network of high power module is presented based on FEM (Finite Element Method) simulation. The thermal coupling impact between chips will be studied and the transient thermal impedances will be examined under different cooling conditions. Finally, the extracted thermal network will be validated with a circuit simulator for a fast temperature estimation with a given loss profile.
OriginalsprogEngelsk
TitelProceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014
Antal sider7
ForlagChungbuk University, Korea
Publikationsdatookt. 2014
Sider1-7
StatusUdgivet - okt. 2014
BegivenhedInternational Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014 - Jeju, Sydkorea
Varighed: 20 okt. 201422 okt. 2014

Konference

KonferenceInternational Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014
LandSydkorea
ByJeju
Periode20/10/201422/10/2014

Fingerprint

Insulated gate bipolar transistors (IGBT)
Wind turbines
Finite element method
Temperature control
Cooling
Hot Temperature
Power bipolar transistors
Power electronics
Temperature measurement
Temperature
Wind power
Transistors
Diodes
Simulators
Networks (circuits)

Citer dette

Bahman, A. S., Ma, K., & Blaabjerg, F. (2014). FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems. I Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014 (s. 1-7). Chungbuk University, Korea.
Bahman, Amir Sajjad ; Ma, Ke ; Blaabjerg, Frede. / FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems. Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014. Chungbuk University, Korea, 2014. s. 1-7
@inproceedings{410831ead2cc4cbabbf58d2cc6416e7b,
title = "FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems",
abstract = "Thermal management of high power IGBT (Insulated Gate Bipolar Transistor) modules is crucial to ensure the reliable operation of power electronic systems especially in wind power applications. The important stage in thermal management of power modules is temperature estimation inside the IGBT modules. Generally, thermal information on datasheet is used to estimate transistor and diode chip temperatures, but this information is based on average and rough temperature measurements. In addition this information does not consider thermal coupling impact between the chips and the impact of different cooling conditions on thermal behavior of power module. In this paper, a detailed 3D thermal network of high power module is presented based on FEM (Finite Element Method) simulation. The thermal coupling impact between chips will be studied and the transient thermal impedances will be examined under different cooling conditions. Finally, the extracted thermal network will be validated with a circuit simulator for a fast temperature estimation with a given loss profile.",
keywords = "Finite Elemennt Method, High power modules, Transient thermal impedance, Thermal coupling",
author = "Bahman, {Amir Sajjad} and Ke Ma and Frede Blaabjerg",
year = "2014",
month = "10",
language = "English",
pages = "1--7",
booktitle = "Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014",
publisher = "Chungbuk University, Korea",

}

Bahman, AS, Ma, K & Blaabjerg, F 2014, FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems. i Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014. Chungbuk University, Korea, s. 1-7, Jeju, Sydkorea, 20/10/2014.

FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems. / Bahman, Amir Sajjad; Ma, Ke; Blaabjerg, Frede.

Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014. Chungbuk University, Korea, 2014. s. 1-7.

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

TY - GEN

T1 - FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems

AU - Bahman, Amir Sajjad

AU - Ma, Ke

AU - Blaabjerg, Frede

PY - 2014/10

Y1 - 2014/10

N2 - Thermal management of high power IGBT (Insulated Gate Bipolar Transistor) modules is crucial to ensure the reliable operation of power electronic systems especially in wind power applications. The important stage in thermal management of power modules is temperature estimation inside the IGBT modules. Generally, thermal information on datasheet is used to estimate transistor and diode chip temperatures, but this information is based on average and rough temperature measurements. In addition this information does not consider thermal coupling impact between the chips and the impact of different cooling conditions on thermal behavior of power module. In this paper, a detailed 3D thermal network of high power module is presented based on FEM (Finite Element Method) simulation. The thermal coupling impact between chips will be studied and the transient thermal impedances will be examined under different cooling conditions. Finally, the extracted thermal network will be validated with a circuit simulator for a fast temperature estimation with a given loss profile.

AB - Thermal management of high power IGBT (Insulated Gate Bipolar Transistor) modules is crucial to ensure the reliable operation of power electronic systems especially in wind power applications. The important stage in thermal management of power modules is temperature estimation inside the IGBT modules. Generally, thermal information on datasheet is used to estimate transistor and diode chip temperatures, but this information is based on average and rough temperature measurements. In addition this information does not consider thermal coupling impact between the chips and the impact of different cooling conditions on thermal behavior of power module. In this paper, a detailed 3D thermal network of high power module is presented based on FEM (Finite Element Method) simulation. The thermal coupling impact between chips will be studied and the transient thermal impedances will be examined under different cooling conditions. Finally, the extracted thermal network will be validated with a circuit simulator for a fast temperature estimation with a given loss profile.

KW - Finite Elemennt Method

KW - High power modules

KW - Transient thermal impedance

KW - Thermal coupling

M3 - Article in proceeding

SP - 1

EP - 7

BT - Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014

PB - Chungbuk University, Korea

ER -

Bahman AS, Ma K, Blaabjerg F. FEM Thermal Modeling and Improvement for High Power IGBT Modules Used in Wind Turbine Systems. I Proceedings of the International Conference on Wind energy Grid-Adaptive Technologies, WEGAT 2014. Chungbuk University, Korea. 2014. s. 1-7