Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires

Maogong Jiang , Guicui Fu, Lorenzo Ceccarelli, He Du, Martin Bendix Fogsgaard, Amir Sajjad Bahman, Yongheng Yang, Francesco Iannuzzo

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Abstrakt

This paper proposes a method to identify damage-sensitive electrical parameters (DESPs) for insulated gate bipolar transistor (IGBT) bond wires. Multiphysics simulations are performed to emulate the realistic electrical, thermal and mechanical behaviors of IGBT module. Temperature-dependent material properties are considered in silicon chips and aluminum bond wires. Steady-state electro-thermo-mechanical simulation results of IGBT modules in a given collector current are presented. The degradation mechanisms of wire-bonding crack propagation and complete lift-off are explored. Simulations are validated through the power cycling tests. The trend of measured forward voltage V CE(on) is similar to the simulation result. The modeling method and results can be used to evaluate the health status of IGBT module bond wires.
OriginalsprogEngelsk
TitelProceedings of 2019 IEEE Energy Conversion Congress and Exposition (ECCE)
Antal sider6
ForlagIEEE Press
Publikationsdatosep. 2019
Sider839-844
Artikelnummer8912236
ISBN (Elektronisk)9781728103952
DOI
StatusUdgivet - sep. 2019
Begivenhed2019 IEEE Energy Conversion Congress and Exposition (ECCE) - Baltimore, USA
Varighed: 29 sep. 20193 okt. 2019

Konference

Konference2019 IEEE Energy Conversion Congress and Exposition (ECCE)
LandUSA
By Baltimore
Periode29/09/201903/10/2019
NavnIEEE Energy Conversion Congress and Exposition
ISSN2329-3721

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Citationsformater

Jiang , M., Fu, G., Ceccarelli, L., Du, H., Fogsgaard, M. B., Bahman, A. S., Yang, Y., & Iannuzzo, F. (2019). Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires. I Proceedings of 2019 IEEE Energy Conversion Congress and Exposition (ECCE) (s. 839-844). [8912236] IEEE Press. IEEE Energy Conversion Congress and Exposition https://doi.org/10.1109/ECCE.2019.8912236