Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires

Maogong Jiang , Guicui Fu, Lorenzo Ceccarelli, He Du, Martin Bendix Fogsgaard, Amir Sajjad Bahman, Yongheng Yang, Francesco Iannuzzo

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

10 Citationer (Scopus)

10 Citationer
1 Ph.d.-afhandling

1 resultater

2020

Impact of Short-Circuit Events on the Remaining Useful Life of SiC MOSFETs and Mitigation Strategy
Du, H., 2020, Aalborg Universitetsforlag. 83 s.
Publikation: Ph.d.-afhandling

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