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Abstract
The thermal behavior of power electronics devices has being a crucial design consideration because it is closely related to the reliability and also the cost of the converter system. Unfortunately, the widely used thermal models based on lumps of thermal resistances and capacitances have their limits to correctly predict the device temperatures, especially when considering the thermal grease and heat sink attached to the power semiconductor devices. In this paper, frequency-domain approach is applied to the modelling of the thermal dynamics for power devices. The limits of the existing RC lump-based thermal networks are explained from a point of view of frequency domain. Based on the discovery, a more advanced thermal model developed in the frequency domain is proposed, which can be easily established by characterizing the slope variation from the bode diagram of the typically used Foster thermal network. The proposed model can be used to predict not only the internal temperature behaviours of the devices but also the behaviours of heat flowing out of the devices. As a result, more correct estimation of device temperature can be achieved when considering the cooling conditions for the devices.
Originalsprog | Engelsk |
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Tidsskrift | I E E E Transactions on Power Electronics |
Vol/bind | 31 |
Udgave nummer | 10 |
Sider (fra-til) | 7183-7193 |
Antal sider | 11 |
ISSN | 0885-8993 |
DOI | |
Status | Udgivet - okt. 2016 |
Fingeraftryk
Dyk ned i forskningsemnerne om 'Frequency-Domain Thermal Modelling and Characterization of Power Semiconductor Devices'. Sammen danner de et unikt fingeraftryk.Projekter
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning