Fundamental-frequency and load-varying thermal cycles effects on lifetime estimation of DFIG power converter

G. Zhang, D. Zhou, J. Yang, F. Blaabjerg

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

14 Citationer (Scopus)

Abstract

In respect to a Doubly-Fed Induction Generator (DFIG) system, its corresponding time scale varies from microsecond level of power semiconductor switching to second level of the mechanical response. In order to map annual thermal profile of the power semiconductors, different approaches have been adopted to handle the fundamental-frequency thermal cycles and load-varying thermal cycles. Their effects on lifetime estimation of the power device in the Back-to-Back (BTB) power converter are evaluated.
OriginalsprogEngelsk
TidsskriftMicroelectronics Reliability
Vol/bind76-77
Sider (fra-til)549-555
Antal sider7
ISSN0026-2714
DOI
StatusUdgivet - sep. 2017
Begivenhed28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) - Bordeaux, Frankrig
Varighed: 25 sep. 201728 sep. 2017

Konference

Konference28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)
Land/OmrådeFrankrig
ByBordeaux
Periode25/09/201728/09/2017

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