Abstract

The structural optimization of power modules for reliability can be performed without physical prototyping if the structural weakness in modules can be assessed on a 3D model. In this study, 3D thermal stress simulation is investigated as a predictive tool for the heat cycle test (R CT) failure point of the medium voltage power module. The module has a multi- layer structure of two different ceramics (A12O3 and AIN) to reduce the parasitic capacitance. In this complex structured module, the failure point of actual test samples are shown to coincide with weakness points of the thermo-mechanical stress in the 3D simulation. The heat cycle test (125/-40°C) was used for simulation and testing. The failure point of the module was predominantly copper delamination from the AIN substrate surface after HCT 100 cycles. The delaminated locations were matched to points in the simulation that has 2 characteristics, high peeling stresses points and high shape deformation of copper pattern at the simulation results. This observation applies to copper patterns only connected to the ceramics, while copper patterns connected to other adjacent layers did not follow this trend.

OriginalsprogEngelsk
TitelAPEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition
Antal sider8
ForlagIEEE
Publikationsdato19 mar. 2023
Sider2668-2675
ISBN (Elektronisk)978-1-6654-7539-6
DOI
StatusUdgivet - 19 mar. 2023
Begivenhed2023 IEEE Applied Power Electronics Conference and Exposition (APEC) - Orlando, FL, USA
Varighed: 19 mar. 202323 mar. 2023

Konference

Konference2023 IEEE Applied Power Electronics Conference and Exposition (APEC)
LokationOrlando, FL, USA
Periode19/03/202323/03/2023

Fingeraftryk

Dyk ned i forskningsemnerne om 'Heat cycle failure point prediction by 3D thermal stress analysis for medium voltage power module'. Sammen danner de et unikt fingeraftryk.

Citationsformater