Impact of lifetime model selections on the reliability prediction of IGBT modules in modular multilevel converters

Yi Zhang, Huai Wang, Zhongxu Wang, Yongheng Yang, Frede Blaabjerg

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33 Citationer (Scopus)
440 Downloads (Pure)

Abstrakt

Power cycling in semiconductor modules contributes to repetitive thermal-mechanical stresses, which in return accumulate as fatigue on the devices, and challenge the lifetime. Typically, lifetime models are expressed in number-of-cycles, within which the device can operate without failures under predefined conditions. In these lifetime models, thermal stresses (e.g., junction temperature variations) are commonly considered. However, the lifetime of power devices involves in crossdisciplinary knowledge. As a result, the lifetime prediction is affected by the selected lifetime model. In this regard, this paper benchmarks the most commonly-employed lifetime models of power semiconductor devices for offshore Modular Multilevel Converters (MMC) based wind farms. The benchmarking reveals that the lifetime model selection has a significant impact on the lifetime estimation. The use of analytical lifetime models should be justified in terms of applicability, limitations, and underlying statistical properties.
OriginalsprogEngelsk
TitelProceedings of 2017 IEEE Energy Conversion Congress and Exposition (ECCE)
Antal sider6
ForlagIEEE Press
Publikationsdatookt. 2017
Sider4202-4207
ISBN (Trykt)978-1-5090-2997-6
DOI
StatusUdgivet - okt. 2017
Begivenhed2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Cincinnati, Ohio, USA
Varighed: 1 okt. 20175 okt. 2017

Konference

Konference2017 IEEE Energy Conversion Congress and Exposition (ECCE)
Land/OmrådeUSA
ByCincinnati, Ohio
Periode01/10/201705/10/2017
NavnIEEE Energy Conversion Congress and Exposition
ISSN2329-3721

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