Impact of the Thermal-Interface-Material Thickness on IGBT Module Reliability in the Modular Multilevel Converter

Yi Zhang, Huai Wang, Zhongxu Wang, Yongheng Yang, Frede Blaabjerg

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

7 Citationer (Scopus)

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Engineering