Fingeraftryk
Dyk ned i forskningsemnerne om 'Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules'. Sammen danner de et unikt fingeraftryk.- Sorter
- Vægt
- Alfabetisk
Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules
Yuan Gao*, Kai Yin, Claus Leth Bak, Asger Bjørn Jørgensen, Zichen Zhang, Hongbo Zhao, Stig Munk-Nielsen, Christian Uhrenfeldt, Thore Stig Aunsborg
*Kontaktforfatter
- Power Electronics Packaging, Materials and Emerging Applications
- Det Ingeniør- og Naturvidenskabelige Fakultet
- AAU Energi
- Electronic Power Grid
- Power Electronics System Integration and Materials
- Modern Power Transmission Grids
- Intelligent Energy Systems and Flexible Markets
- Electric Power Systems and Microgrids
Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review