Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current

Mohammadkazem Bakhshizadeh Dowlatabadi; Ke Ma; Poh Chiang Loh; Frede Blaabjerg

doi:10.1109/APEC.2015.7104649

Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current

Mohammadkazem Bakhshizadeh Dowlatabadi, Ke Ma, Poh Chiang Loh, Frede Blaabjerg

AAU Energi

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

40 Citationer (Scopus)

Abstract

Modular Multilevel Converter (MMC) has recently become a popular multilevel topology for high-power applications, where the reliability performance is a crucial design consideration. In this paper the impacts of the circulating current in the MMC to the loss and thermal loading of power semiconductor devices are comprehensively investigated. Also a novel control strategy by utilizing the circulating current is proposed to enhance the reliability performance of MMC in order to limit the amplitude of thermal cycles. It is concluded that the circulating current may change the losses and thermal loading of the power devices, and by proper controlling the amount of circulating current, the temperature fluctuation or thermal cycling in the power device can be relieved, and thereby contributing to improved reliability performance according to many lifetime models/testing results for power devices.

Originalsprog	Engelsk
Titel	Proceedings of the 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015
Antal sider	7
Forlag	IEEE Press
Publikationsdato	mar. 2015
Sider	2167-2173
ISBN (Trykt)	978-1-4799-6735-3
DOI	https://doi.org/10.1109/APEC.2015.7104649
Status	Udgivet - mar. 2015
Begivenhed	30th Annual IEEE Applied Power Electronics Conference and Exposition - Charlotte, USA Varighed: 15 mar. 2015 → 19 mar. 2015

Konference

Konference	30th Annual IEEE Applied Power Electronics Conference and Exposition
Land/Område	USA
By	Charlotte
Periode	15/03/2015 → 19/03/2015

Navn	I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings
ISSN	1048-2334

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10.1109/APEC.2015.7104649

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http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7104649&queryText=Indirect+thermal+control+for+improved+reliability+of+Modular+Multilevel+Converter+by+utilizing+circulating+current&newsearch=true&searchField=Search_All

Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning

Citationsformater

Dowlatabadi, Mohammadkazem Bakhshizadeh ; Ma, Ke ; Loh, Poh Chiang et al. / Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current. Proceedings of the 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015. IEEE Press, 2015. s. 2167-2173 (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings).

@inproceedings{884f03378c8c455fb070bc1886f814c8,

title = "Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current",

abstract = "Modular Multilevel Converter (MMC) has recently become a popular multilevel topology for high-power applications, where the reliability performance is a crucial design consideration. In this paper the impacts of the circulating current in the MMC to the loss and thermal loading of power semiconductor devices are comprehensively investigated. Also a novel control strategy by utilizing the circulating current is proposed to enhance the reliability performance of MMC in order to limit the amplitude of thermal cycles. It is concluded that the circulating current may change the losses and thermal loading of the power devices, and by proper controlling the amount of circulating current, the temperature fluctuation or thermal cycling in the power device can be relieved, and thereby contributing to improved reliability performance according to many lifetime models/testing results for power devices.",

keywords = "Active Thermal Control, Reliability, Power Electronics, Modular Multilevel Converter, Circulating Current",

author = "Dowlatabadi, {Mohammadkazem Bakhshizadeh} and Ke Ma and Loh, {Poh Chiang} and Frede Blaabjerg",

year = "2015",

month = mar,

doi = "10.1109/APEC.2015.7104649",

language = "English",

isbn = "978-1-4799-6735-3",

series = "I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings",

publisher = "IEEE Press",

pages = "2167--2173",

booktitle = "Proceedings of the 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015",

note = "30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015, IEEE APEC 2015 ; Conference date: 15-03-2015 Through 19-03-2015",

}

Dowlatabadi, MB, Ma, K, Loh, PC & Blaabjerg, F 2015, Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current. i Proceedings of the 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015. IEEE Press, I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings, s. 2167-2173, 30th Annual IEEE Applied Power Electronics Conference and Exposition, Charlotte, USA, 15/03/2015. https://doi.org/10.1109/APEC.2015.7104649

Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current. / Dowlatabadi, Mohammadkazem Bakhshizadeh; Ma, Ke; Loh, Poh Chiang et al.
Proceedings of the 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015. IEEE Press, 2015. s. 2167-2173 (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings).

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

TY - GEN

T1 - Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current

AU - Dowlatabadi, Mohammadkazem Bakhshizadeh

AU - Ma, Ke

AU - Loh, Poh Chiang

AU - Blaabjerg, Frede

PY - 2015/3

Y1 - 2015/3

N2 - Modular Multilevel Converter (MMC) has recently become a popular multilevel topology for high-power applications, where the reliability performance is a crucial design consideration. In this paper the impacts of the circulating current in the MMC to the loss and thermal loading of power semiconductor devices are comprehensively investigated. Also a novel control strategy by utilizing the circulating current is proposed to enhance the reliability performance of MMC in order to limit the amplitude of thermal cycles. It is concluded that the circulating current may change the losses and thermal loading of the power devices, and by proper controlling the amount of circulating current, the temperature fluctuation or thermal cycling in the power device can be relieved, and thereby contributing to improved reliability performance according to many lifetime models/testing results for power devices.

AB - Modular Multilevel Converter (MMC) has recently become a popular multilevel topology for high-power applications, where the reliability performance is a crucial design consideration. In this paper the impacts of the circulating current in the MMC to the loss and thermal loading of power semiconductor devices are comprehensively investigated. Also a novel control strategy by utilizing the circulating current is proposed to enhance the reliability performance of MMC in order to limit the amplitude of thermal cycles. It is concluded that the circulating current may change the losses and thermal loading of the power devices, and by proper controlling the amount of circulating current, the temperature fluctuation or thermal cycling in the power device can be relieved, and thereby contributing to improved reliability performance according to many lifetime models/testing results for power devices.

KW - Active Thermal Control

KW - Reliability

KW - Power Electronics

KW - Modular Multilevel Converter

KW - Circulating Current

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Dowlatabadi MB, Ma K, Loh PC, Blaabjerg F. Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current. I Proceedings of the 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015. IEEE Press. 2015. s. 2167-2173. (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings). doi: 10.1109/APEC.2015.7104649

Indirect thermal control for improved reliability of Modular Multilevel Converter by utilizing circulating current

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