TY - JOUR
T1 - Influence of Paralleling Dies and Paralleling Half-Bridges on Transient Current Distribution in Multichip Power Modules
AU - Li, Helong
AU - Zhou, Wei
AU - Wang, Xiongfei
AU - Munk-Nielsen, Stig
AU - Li, Daohui
AU - Wang, Yangang
AU - Dai, Xiaoping
PY - 2018/8
Y1 - 2018/8
N2 - This letter addresses the transient current distribution in the multichip half-bridge power modules, where two types of paralleling connections with different current commutation mechanisms are considered: paralleling dies and paralleling half-bridges. It reveals that with paralleling dies, both the high-side and low-side paralleled devices experience a similar transient current imbalance due to the mismatched stray inductance. However, with paralleling half-bridges and with the same mismatched stray inductances, the high-side paralleled devices have much smaller transient current imbalance, the cause of which is found be to the current commutation process. Theoretical analysis based on the circuit modeling and current commutation process elaborates the findings, which are then confirmed by experimental results.
AB - This letter addresses the transient current distribution in the multichip half-bridge power modules, where two types of paralleling connections with different current commutation mechanisms are considered: paralleling dies and paralleling half-bridges. It reveals that with paralleling dies, both the high-side and low-side paralleled devices experience a similar transient current imbalance due to the mismatched stray inductance. However, with paralleling half-bridges and with the same mismatched stray inductances, the high-side paralleled devices have much smaller transient current imbalance, the cause of which is found be to the current commutation process. Theoretical analysis based on the circuit modeling and current commutation process elaborates the findings, which are then confirmed by experimental results.
KW - Parallel connection
KW - Current distribution
KW - Multichip power module
KW - SiC MOSFET
KW - IGBT
UR - http://www.scopus.com/inward/record.url?scp=85040994634&partnerID=8YFLogxK
U2 - 10.1109/TPEL.2018.2797326
DO - 10.1109/TPEL.2018.2797326
M3 - Journal article
SN - 0885-8993
VL - 33
SP - 6483
EP - 6487
JO - I E E E Transactions on Power Electronics
JF - I E E E Transactions on Power Electronics
IS - 8
ER -