Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules

Kristian Bonderup Pedersen, David Benning, Peter Kjær Kristensen, Vladimir Popok, Kjeld Pedersen

Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review

Originalsprog	Engelsk
Tidsskrift	Journal of Materials Science: Materials in Electronics
Vol/bind	25
Udgave nummer	7
Sider (fra-til)	2863-2871
Antal sider	7
ISSN	0957-4522
DOI	https://doi.org/10.1007/s10854-014-1953-8
Status	Udgivet - jul. 2014

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@article{6c4e24e8d87c48448f4dc0fd802f509e,

title = "Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules",

author = "Pedersen, {Kristian Bonderup} and David Benning and Kristensen, {Peter Kj{\ae}r} and Vladimir Popok and Kjeld Pedersen",

year = "2014",

month = jul,

doi = "10.1007/s10854-014-1953-8",

language = "English",

volume = "25",

pages = "2863--2871",

journal = "Journal of Materials Science: Materials in Electronics",

issn = "0957-4522",

publisher = "Springer",

number = "7",

}

Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review

TY - JOUR

T1 - Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules

AU - Pedersen, Kristian Bonderup

AU - Benning, David

AU - Kristensen, Peter Kjær

AU - Popok, Vladimir

AU - Pedersen, Kjeld

PY - 2014/7

Y1 - 2014/7

U2 - 10.1007/s10854-014-1953-8

DO - 10.1007/s10854-014-1953-8

M3 - Journal article

SN - 0957-4522

VL - 25

SP - 2863

EP - 2871

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

IS - 7

ER -