Investigation of acoustic emission as a non-invasive method for detection of power semiconductor aging

Pooya Davari, Ole Damm Kristensen, Francesco Iannuzzo

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

1 Citation (Scopus)
26 Downloads (Pure)

Resumé

In this paper, recording of acoustic emission during real operations is used for non-invasively detecting the aging of a power seminconductor module due to power cycling. The presented method is very simple and particularly attractive because of non-invasiveness and potential low-cost features, which can enable straightforward adoption in condition monitoring of power electronic devices. Nevertheless, a spectrum analysis is needed to process the acquired data. Experimental results show a strong correlation between acoustic emission and on-state voltage drop, which is the standard indicator of degradation in bond wires. A comparison with the results obtained with another identical module gave excellent repeatability, confirming that the method is very promising for real application.
OriginalsprogEngelsk
TidsskriftMicroelectronics Reliability
Vol/bind88-90
Sider (fra-til)545-549
Antal sider5
ISSN0026-2714
DOI
StatusUdgivet - sep. 2018
Begivenhed29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Danmark
Varighed: 1 okt. 20185 okt. 2018
Konferencens nummer: 29th
http://www.esref2018conf.org/

Konference

Konference29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Nummer29th
LokationAKKC
LandDanmark
ByAalborg
Periode01/10/201805/10/2018
Internetadresse

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acoustic emission
Acoustic emissions
Aging of materials
Semiconductor materials
Condition monitoring
Power electronics
Spectrum analysis
spectrum analysis
modules
recording
wire
Wire
degradation
Degradation
cycles
electric potential
electronics
Costs
Voltage drop

Citer dette

@inproceedings{1fbcc149eaef40a08fe6a0e9c46903a0,
title = "Investigation of acoustic emission as a non-invasive method for detection of power semiconductor aging",
abstract = "In this paper, recording of acoustic emission during real operations is used for non-invasively detecting the aging of a power seminconductor module due to power cycling. The presented method is very simple and particularly attractive because of non-invasiveness and potential low-cost features, which can enable straightforward adoption in condition monitoring of power electronic devices. Nevertheless, a spectrum analysis is needed to process the acquired data. Experimental results show a strong correlation between acoustic emission and on-state voltage drop, which is the standard indicator of degradation in bond wires. A comparison with the results obtained with another identical module gave excellent repeatability, confirming that the method is very promising for real application.",
keywords = "Power semiconductor aging, acoustic emission, power cycling, frequency domain analysis, Wearout, Non-invasive wear-out detection, IGBT, condition monitorin",
author = "Pooya Davari and Kristensen, {Ole Damm} and Francesco Iannuzzo",
year = "2018",
month = "9",
doi = "10.1016/j.microrel.2018.06.074",
language = "English",
volume = "88-90",
pages = "545--549",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Pergamon Press",

}

Investigation of acoustic emission as a non-invasive method for detection of power semiconductor aging. / Davari, Pooya; Kristensen, Ole Damm; Iannuzzo, Francesco.

I: Microelectronics Reliability, Bind 88-90, 09.2018, s. 545-549.

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

TY - GEN

T1 - Investigation of acoustic emission as a non-invasive method for detection of power semiconductor aging

AU - Davari, Pooya

AU - Kristensen, Ole Damm

AU - Iannuzzo, Francesco

PY - 2018/9

Y1 - 2018/9

N2 - In this paper, recording of acoustic emission during real operations is used for non-invasively detecting the aging of a power seminconductor module due to power cycling. The presented method is very simple and particularly attractive because of non-invasiveness and potential low-cost features, which can enable straightforward adoption in condition monitoring of power electronic devices. Nevertheless, a spectrum analysis is needed to process the acquired data. Experimental results show a strong correlation between acoustic emission and on-state voltage drop, which is the standard indicator of degradation in bond wires. A comparison with the results obtained with another identical module gave excellent repeatability, confirming that the method is very promising for real application.

AB - In this paper, recording of acoustic emission during real operations is used for non-invasively detecting the aging of a power seminconductor module due to power cycling. The presented method is very simple and particularly attractive because of non-invasiveness and potential low-cost features, which can enable straightforward adoption in condition monitoring of power electronic devices. Nevertheless, a spectrum analysis is needed to process the acquired data. Experimental results show a strong correlation between acoustic emission and on-state voltage drop, which is the standard indicator of degradation in bond wires. A comparison with the results obtained with another identical module gave excellent repeatability, confirming that the method is very promising for real application.

KW - Power semiconductor aging

KW - acoustic emission

KW - power cycling

KW - frequency domain analysis

KW - Wearout

KW - Non-invasive wear-out detection

KW - IGBT

KW - condition monitorin

UR - http://www.scopus.com/inward/record.url?scp=85054872124&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2018.06.074

DO - 10.1016/j.microrel.2018.06.074

M3 - Conference article in Journal

VL - 88-90

SP - 545

EP - 549

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

ER -