Investigation of acoustic emission as a non-invasive method for detection of power semiconductor aging

Pooya Davari, Ole Damm Kristensen, Francesco Iannuzzo

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

5 Citationer (Scopus)
59 Downloads (Pure)

Abstrakt

In this paper, recording of acoustic emission during real operations is used for non-invasively detecting the aging of a power seminconductor module due to power cycling. The presented method is very simple and particularly attractive because of non-invasiveness and potential low-cost features, which can enable straightforward adoption in condition monitoring of power electronic devices. Nevertheless, a spectrum analysis is needed to process the acquired data. Experimental results show a strong correlation between acoustic emission and on-state voltage drop, which is the standard indicator of degradation in bond wires. A comparison with the results obtained with another identical module gave excellent repeatability, confirming that the method is very promising for real application.
OriginalsprogEngelsk
TidsskriftMicroelectronics Reliability
Vol/bind88-90
Sider (fra-til)545-549
Antal sider5
ISSN0026-2714
DOI
StatusUdgivet - sep. 2018
Begivenhed29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Danmark
Varighed: 1 okt. 20185 okt. 2018
Konferencens nummer: 29th
http://www.esref2018conf.org/

Konference

Konference29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Nummer29th
LokationAKKC
LandDanmark
ByAalborg
Periode01/10/201805/10/2018
Internetadresse

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