@inproceedings{1036c186f94a4074b3d12b979581692b,
title = "Junction temperature estimation method for a 600 V, 30A IGBT module during converter operation",
abstract = "This paper proposes an accurate method to estimate the junction temperature using the on-state collector-emitter voltage at high current. By means of the proposed method, the estimation error which comes from the different temperatures of the interconnection materials in the module is compensated. Finally, it leads to satisfactory estimated results. The proposed method has been verified by means of an IR (Infra-Red) camera during power converter operations when the loading current is sinusoidal.",
keywords = "Converter, IGBT module, Junction temperature estimation, TSEP, Junction temperature estimation, IGBT module, Converter, TSEP",
author = "Choi, {U. M.} and F. Blaabjerg and F. Iannuzzo and S. J{\o}rgensen",
year = "2015",
month = aug,
doi = "10.1016/j.microrel.2015.06.146",
language = "English",
series = "Microelectronics Reliability",
publisher = "Elsevier",
number = "9-10",
pages = "2022--2026",
editor = "Phillippe Perdu and Francois Marc and Marise Bafleur and Helene Fremont and Nicolas Nohlier",
booktitle = "Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis",
address = "United Kingdom",
note = "26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ; Conference date: 05-10-2015 Through 09-10-2015",
}