Mechanisms of metallization degradation in high power diodes

Mads Brincker, Peter Kjær Kristensen, Kristian Bonderup Pedersen, Vladimir Popok

    Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

    4 Citationer (Scopus)

    Abstrakt

    Under operation the topside metallization of power electronic chips is commonly observed to degrade and thereby affecta device's electrical characteristics. However, the mechanisms of the degradation process and the role of environmental factors are not yet fully understood. In this work, we investigate the metallization degradation by passive thermal cycling of unpackaged high-power diode chips in different controlled atmospheres. The electrical degradation of the metallization is characterized by sheet resistance measurements, while the microstructural damage is investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). To study the evolution of the chemical composition of the metallization, energy dispersive X-ray spectroscopy (EDX) is also applied. Since the degradation depends on the initial microstructure of the metallization, the film texture and grain size distribution is determined using electron backscatter diffraction (EBSD). The obtained data show that the type of atmosphere plays a minor role in the degradation process, with a slight tendency that cycling in dry nitrogen atmosphere accelerates the degradation compared to the experiments in ambient atmosphere with a controlled relative humidity of 50 and 95%.
    OriginalsprogEngelsk
    TidsskriftMicroelectronics Reliability
    Vol/bind64
    Sider (fra-til)489–493
    Antal sider5
    ISSN0026-2714
    DOI
    StatusUdgivet - 18 sep. 2016
    Begivenhed27th EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, - Händel-Halle
    Varighed: 19 sep. 201622 sep. 2016
    Konferencens nummer: 27
    http://conference.vde.com/esref-2016/Pages/default.aspx

    Konference

    Konference27th EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES,
    Nummer27
    ByHändel-Halle
    Periode19/09/201622/09/2016
    Internetadresse

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