Publikationer pr. år
Publikationer pr. år
- 22 resultater
Søgeresultater
-
2017
An Analytical Essential Switching Loss Estimation Method for Modular Multilevel Converters with Nearest Level Modulation
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., okt. 2017, Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017. IEEE Press, s. 762-767 6 s.Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
8 Citationer (Scopus) -
Impact of lifetime model selections on the reliability prediction of IGBT modules in modular multilevel converters
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., okt. 2017, Proceedings of 2017 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE Press, s. 4202-4207 6 s. (IEEE Energy Conversion Congress and Exposition).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Åben adgangFil61 Citationer (Scopus)648 Downloads (Pure) -
The Impact of Mission Profile Models on the Predicted Lifetime of IGBT Modules in the Modular Multilevel Converter
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., okt. 2017, Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017. IEEE Press, s. 7980-7985 6 s.Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Fil26 Citationer (Scopus)376 Downloads (Pure) -
2018
A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., sep. 2018, I: Microelectronics Reliability. 88-90, s. 519-523 5 s.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
Fil6 Citationer (Scopus)327 Downloads (Pure) -
An empirical model for thermal interface materials based on experimental characterizations under realistic conditions
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., sep. 2018, I: Microelectronics Reliability. 88-90, s. 806-811 6 s.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
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Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., 22 okt. 2018, 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, s. 3123-3128 6 s. 8507731Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Åben adgangFil17 Citationer (Scopus)301 Downloads (Pure) -
Impact of the Thermal-Interface-Material Thickness on IGBT Module Reliability in the Modular Multilevel Converter
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., 22 okt. 2018, 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, s. 2743-2749 7 s. 8507408Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
7 Citationer (Scopus) -
Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., sep. 2018, Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press, s. 6830-6837 8 s. (IEEE Energy Conversion Congress and Exposition).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
2 Citationer (Scopus) -
Submodule Level Power Loss Balancing Control for Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., sep. 2018, Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press, s. 5731 - 5736 6 s. (IEEE Energy Conversion Congress and Exposition).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Åben adgangFil13 Citationer (Scopus)374 Downloads (Pure) -
2019
A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., 24 maj 2019, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. USA: IEEE Press, s. 313-318 6 s. 8721785. (IEEE Applied Power Electronics Conference and Exposition (APEC)).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Fil155 Downloads (Pure) -
A Simplification Method for Power Device Thermal Modeling with Quantitative Error Analysis
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., sep. 2019, I: IEEE Journal of Emerging and Selected Topics in Power Electronics. 7, 3, s. 1649-1658 10 s., 8713595.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
18 Citationer (Scopus) -
A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., dec. 2019, I: IEEE Transactions on Power Electronics. 34, 12, s. 11580 - 11593 14 s., 8678463.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
Fil21 Citationer (Scopus)273 Downloads (Pure) -
Computational-Efficient Thermal Estimation for IGBT Modules under Periodic Power Loss Profiles in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., 1 sep. 2019, I: IEEE Transactions on Industry Applications. 55, 5, s. 4984 - 4992 9 s., 8747388.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
Åben adgangFil14 Citationer (Scopus)119 Downloads (Pure) -
Condition Monitoring for Submodule Capacitors in Modular Multilevel Converters
Wang, H., Wang, H., Wang, Z., Zhang, Y., Pei, X. & Kang, Y., nov. 2019, I: IEEE Transactions on Power Electronics. 34, 11, s. 10403 - 10407 5 s., 8718539.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
Åben adgangFil42 Citationer (Scopus)205 Downloads (Pure) -
Condition monitoring method for submodule capacitor in modular multilevel converter
Wang, H., Wang, H., Zhang, Y., Wang, Z., Pei, X. & Kang, Y., mar. 2019, Proceedings of 2019 IEEE Annual Applied Power Electronics Conference and Exposition (APEC 2019). IEEE Press, s. 344-348 5 s. (IEEE Applied Power Electronics Conference and Exposition (APEC)).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
6 Citationer (Scopus)6 Downloads (Pure) -
Mission Profile Based Adaptive Carrier Frequency Control for Modular Multilevel Converters for Medium Voltage Applications
Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., maj 2019, Proceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia). Korea: IEEE Press, s. 1848-1853 6 s. 8796902. (International Conference on Power Electronics).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Åben adgangFil81 Downloads (Pure) -
Reliability Modeling of Power Electronic Converters: A General Approach
Peyghami, S., Wang, Z. & Blaabjerg, F., jun. 2019, Proceedings of 2019 20th Workshop on Control and Modeling for Power Electronics (COMPEL). IEEE Press, 7 s. 8769685. (IEEE Workshop on Control and Modeling for Power Electronics (COMPEL) ).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Fil32 Citationer (Scopus)521 Downloads (Pure) -
Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules
Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., 24 maj 2019, Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press, s. 319-324 6 s. 8721898. (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Åben adgangFil20 Citationer (Scopus)170 Downloads (Pure) -
Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., mar. 2019, I: IEEE Transactions on Industrial Electronics. 66, 3, s. 2323-2332 10 s., 8331948.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
Åben adgangFil97 Citationer (Scopus)997 Downloads (Pure) -
System-Level Power Loss Evaluation of Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Blaabjerg, F. & Saeedifard, M., sep. 2019, 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019. IEEE Press, s. 6797-6804 8 s. 8913051. (IEEE Energy Conversion Congress and Exposition).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Åben adgangFil5 Citationer (Scopus)225 Downloads (Pure) -
2020
Capacitor Condition Monitoring Based on the DC-Side Start-Up of Modular Multilevel Converters
Wang, Z., Zhang, Y., Wang, H. & Blaabjerg, F., jun. 2020, I: IEEE Transactions on Power Electronics. 35, 6, s. 5589-5593 5 s., 8918114.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
Åben adgangFil37 Citationer (Scopus)115 Downloads (Pure) -
Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters
Zhang, Y., Wang, H., Wang, Z., Blaabjerg, F. & Saeedifard, M., jul. 2020, I: IEEE Transactions on Power Electronics. 35, 7, s. 6916-6930 15 s., 8926422.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
Åben adgangFil60 Citationer (Scopus)434 Downloads (Pure)