Abstract
The reliability analysis and lifetime prediction for SiC-based power modules is crucial in order to fulfill the design specifications for next-generation power converters. This paper presents a fast mission-profile-based simulation strategy for a commercial 1.2-kV all-SiC power module used in a photovoltaic inverter topology. The approach relies on a fast condition-mapping simulation structure and the detailed electro-thermal modeling of the module topology and devices. Both parasitic electrical elements and thermal impedance network are extracted from the finite-element analysis of the module geometry. The use of operating conditions mapping and look-up tables enables the simulation of very long timescales in only a few minutes, preserving at the same time the accuracy of circuit-based simulations. The accumulated damage related to thermo-mechanical stress on the module is determined analytically, and a simple consumed lifetime calculation is performed for two different mission profiles and compared in different operating conditions.
Originalsprog | Engelsk |
---|---|
Artikelnummer | 8616890 |
Tidsskrift | IEEE Transactions on Power Electronics |
Vol/bind | 34 |
Udgave nummer | 10 |
Sider (fra-til) | 9698-9708 |
Antal sider | 11 |
ISSN | 0885-8993 |
DOI | |
Status | Udgivet - okt. 2019 |