Mission Profile-based System-Level Reliability Prediction Method for Modular Multilevel Converters

Yi Zhang*, Huai Wang, Zhongxu Wang, Frede Blaabjerg, Maryam Saeedifard

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13 Citationer (Scopus)
125 Downloads (Pure)

Abstrakt

This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.

OriginalsprogEngelsk
Artikelnummer8926422
TidsskriftIEEE Transactions on Power Electronics
Vol/bind35
Udgave nummer7
Sider (fra-til)6916-6930
Antal sider15
ISSN0885-8993
DOI
StatusUdgivet - jul. 2020

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