Publikationer pr. år
Publikationer pr. år
Yi Zhang*, Huai Wang, Zhongxu Wang, Frede Blaabjerg, Maryam Saeedifard
Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications.
Originalsprog | Engelsk |
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Artikelnummer | 8926422 |
Tidsskrift | IEEE Transactions on Power Electronics |
Vol/bind | 35 |
Udgave nummer | 7 |
Sider (fra-til) | 6916-6930 |
Antal sider | 15 |
ISSN | 0885-8993 |
DOI | |
Status | Udgivet - jul. 2020 |
Zhang, Yi (Modtager), Wang, Huai (Modtager), Wang, Zhongxu (Modtager), Blaabjerg, Frede (Modtager) & Saeedifard, Maryam (Modtager), 10 aug. 2021
Pris: Forsknings- uddannelses og innovationspriser
Publikation: Ph.d.-afhandling