Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Amir Sajjad Bahman; Francesco Iannuzzo; Christian Uhrenfeldt; Frede Blaabjerg; Stig Munk-Nielsen

doi:10.1109/TIA.2017.2702594

Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Amir Sajjad Bahman, Francesco Iannuzzo, Christian Uhrenfeldt, Frede Blaabjerg, Stig Munk-Nielsen

Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review

31 Citationer (Scopus)

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Abstract

In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

Originalsprog	Engelsk
Tidsskrift	I E E E Transactions on Industry Applications
Vol/bind	53
Udgave nummer	5
Sider (fra-til)	4788 - 4795
Antal sider	8
ISSN	0093-9994
DOI	https://doi.org/10.1109/TIA.2017.2702594
Status	Udgivet - sep. 2017

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10.1109/TIA.2017.2702594

Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT ModulesAccepteret manuskript, 996 KB

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APETT: Advanced Power Electronic Technology and Tools
Blaabjerg, F., Munk-Nielsen, S., Iannuzzo, F., Wang, H., Uhrenfeldt, C., Beczkowski, S. M., Zhou, D., Choi, U., Jørgensen, A. B., Vernica, I., Sangwongwanich, A., Christensen, N., Ceccarelli, L., Nielsen, C. K., Bahman, A. S., Pedersen, K., Pedersen, K. B. & Kristensen, P. K.
Innovationsfonden
01/01/2017 → 30/06/2021
Projekter: Projekt › Forskning

Citationsformater

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title = "Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules",

abstract = "In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.",

keywords = "Electro-thermal models, Insulated gate bipolar transistor (IGBT), Reliability, Short-circuit, Solder fatigue",

author = "Bahman, {Amir Sajjad} and Francesco Iannuzzo and Christian Uhrenfeldt and Frede Blaabjerg and Stig Munk-Nielsen",

year = "2017",

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AU - Bahman, Amir Sajjad

AU - Iannuzzo, Francesco

AU - Uhrenfeldt, Christian

AU - Blaabjerg, Frede

AU - Munk-Nielsen, Stig

PY - 2017/9

Y1 - 2017/9

N2 - In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

AB - In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

KW - Electro-thermal models

KW - Insulated gate bipolar transistor (IGBT)

KW - Reliability

KW - Short-circuit

KW - Solder fatigue

U2 - 10.1109/TIA.2017.2702594

DO - 10.1109/TIA.2017.2702594

M3 - Journal article

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VL - 53

SP - 4788

EP - 4795

JO - I E E E Transactions on Industry Applications

JF - I E E E Transactions on Industry Applications

IS - 5

ER -

Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Abstract

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APETT: Advanced Power Electronic Technology and Tools

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