It is well known that the dynamical change of the thermal stress in the power devices is one of the major factors that have inﬂuences on the overall efﬁciency and reliability of power electronics. The main objective of this paper consists of identifying the main parameters that affect the thermal cycling of power devices in a motor drive application and modelling their impact on the thermal stress. The motor drive system together with the thermal cycling in the power semiconductors have been modelled, and after investigating the dynamic behavior of the system, adverse temperature swings are identiﬁed during the acceleration and deceleration periods of the motor. The main causes for these adverse thermal cycles have been presented and, consequently, the inﬂuence of the deceleration slope, modulation technique and reactive current on the thermal cycles has been analyzed. Finally, the improved thermal response of the power devices is validated through experimental results.
|Titel||Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016|
|Status||Udgivet - sep. 2016|
|Begivenhed|| 8th Annual IEEE Energy Conversion Congress & Exposition: ECCE 2016 - Milwaukee, WI, USA|
Varighed: 18 sep. 2016 → 22 sep. 2016
|Konference||8th Annual IEEE Energy Conversion Congress & Exposition|
|Periode||18/09/2016 → 22/09/2016|
|Sponsor||IEEE, IEEE Industry Applications Society (IAS), IEEE Power Electronics and Industry Applications Societies (PELS)|