Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

3 Citationer (Scopus)

Resumé

Model of a generic printed circuit board (PCB) in a presence of a finite-sized
metallic ground plane is introduced as a commonly occurring scenario of electronic module whose electromagnetic fields are disturbed by a nearby object. Finite-difference time-domain simulations are performed for this scenario and a scenario where the PCB is replaced by near field sources following Love's equivalence theorem. Both scenarios are compared and the maximum total error is evaluated as 84%. It is then demonstrated that including the bottom metallic layer of the PCB,
as its characteristic feature, in the latter scenario leads to significantly lower errors - a figure of 33% is reported.
OriginalsprogEngelsk
TitelPIERS 2012 Kuala Lumpur Proceedings
Antal sider4
ForlagThe Electromagnetics Academy
Publikationsdato2012
Sider1146-1149
ISBN (Trykt)978-1-934142-20-2
StatusUdgivet - 2012
Begivenhed2012 Progress in Electromagnetics Research Symposium - Kuala Lumpur, Malaysia
Varighed: 27 mar. 201230 mar. 2012

Konference

Konference2012 Progress in Electromagnetics Research Symposium
LandMalaysia
ByKuala Lumpur
Periode27/03/201230/03/2012
NavnPIERS Proceedings
ISSN1559-9450

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Printed circuit boards
Electromagnetic fields

Citer dette

Franek, O., Sørensen, M., Ebert, H., & Pedersen, G. F. (2012). Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane. I PIERS 2012 Kuala Lumpur Proceedings (s. 1146-1149). The Electromagnetics Academy. PIERS Proceedings
Franek, Ondrej ; Sørensen, Morten ; Ebert, Hans ; Pedersen, Gert Frølund. / Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane. PIERS 2012 Kuala Lumpur Proceedings. The Electromagnetics Academy, 2012. s. 1146-1149 (PIERS Proceedings).
@inproceedings{f656590fd98c472092db087dce95ee00,
title = "Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane",
abstract = "Model of a generic printed circuit board (PCB) in a presence of a finite-sizedmetallic ground plane is introduced as a commonly occurring scenario of electronic module whose electromagnetic fields are disturbed by a nearby object. Finite-difference time-domain simulations are performed for this scenario and a scenario where the PCB is replaced by near field sources following Love's equivalence theorem. Both scenarios are compared and the maximum total error is evaluated as 84{\%}. It is then demonstrated that including the bottom metallic layer of the PCB,as its characteristic feature, in the latter scenario leads to significantly lower errors - a figure of 33{\%} is reported.",
keywords = "electromagnetic compatibility",
author = "Ondrej Franek and Morten S{\o}rensen and Hans Ebert and Pedersen, {Gert Fr{\o}lund}",
year = "2012",
language = "English",
isbn = "978-1-934142-20-2",
series = "PIERS Proceedings",
publisher = "The Electromagnetics Academy",
pages = "1146--1149",
booktitle = "PIERS 2012 Kuala Lumpur Proceedings",

}

Franek, O, Sørensen, M, Ebert, H & Pedersen, GF 2012, Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane. i PIERS 2012 Kuala Lumpur Proceedings. The Electromagnetics Academy, PIERS Proceedings, s. 1146-1149, Kuala Lumpur, Malaysia, 27/03/2012.

Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane. / Franek, Ondrej; Sørensen, Morten; Ebert, Hans; Pedersen, Gert Frølund.

PIERS 2012 Kuala Lumpur Proceedings. The Electromagnetics Academy, 2012. s. 1146-1149 (PIERS Proceedings).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

TY - GEN

T1 - Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane

AU - Franek, Ondrej

AU - Sørensen, Morten

AU - Ebert, Hans

AU - Pedersen, Gert Frølund

PY - 2012

Y1 - 2012

N2 - Model of a generic printed circuit board (PCB) in a presence of a finite-sizedmetallic ground plane is introduced as a commonly occurring scenario of electronic module whose electromagnetic fields are disturbed by a nearby object. Finite-difference time-domain simulations are performed for this scenario and a scenario where the PCB is replaced by near field sources following Love's equivalence theorem. Both scenarios are compared and the maximum total error is evaluated as 84%. It is then demonstrated that including the bottom metallic layer of the PCB,as its characteristic feature, in the latter scenario leads to significantly lower errors - a figure of 33% is reported.

AB - Model of a generic printed circuit board (PCB) in a presence of a finite-sizedmetallic ground plane is introduced as a commonly occurring scenario of electronic module whose electromagnetic fields are disturbed by a nearby object. Finite-difference time-domain simulations are performed for this scenario and a scenario where the PCB is replaced by near field sources following Love's equivalence theorem. Both scenarios are compared and the maximum total error is evaluated as 84%. It is then demonstrated that including the bottom metallic layer of the PCB,as its characteristic feature, in the latter scenario leads to significantly lower errors - a figure of 33% is reported.

KW - electromagnetic compatibility

UR - http://www.scopus.com/inward/record.url?scp=84868518150&partnerID=8YFLogxK

M3 - Article in proceeding

SN - 978-1-934142-20-2

T3 - PIERS Proceedings

SP - 1146

EP - 1149

BT - PIERS 2012 Kuala Lumpur Proceedings

PB - The Electromagnetics Academy

ER -

Franek O, Sørensen M, Ebert H, Pedersen GF. Near-Field Characterization of a Printed Circuit Board in the Presence of a Finite-sized Metallic Ground Plane. I PIERS 2012 Kuala Lumpur Proceedings. The Electromagnetics Academy. 2012. s. 1146-1149. (PIERS Proceedings).