Projekter pr. år
Abstract
Being the power loss and temperature distribution in power-electronics semiconductor dies influenced by one another, this paper demonstrates that neglecting such an effect can result in significant errors in electro-thermal simulations and mistaken calculation of junction temperatures. Two case studies on different semiconductor technologies, namely Silicon Insulated-Gate Bipolar Transistors (IGBTs) and Silicon Carbide Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), are presented to corroborate the paper findings. Resultant temperature distributions are obtained by a proposed flowchart, which accepts the corresponding power dissipation input from MATLAB environment and employs a finite element based analysis implemented in COMSOL Multiphysics environment.
Originalsprog | Engelsk |
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Titel | Proceedings of the 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
Antal sider | 6 |
Forlag | IEEE Press |
Publikationsdato | sep. 2018 |
Sider | 1-6 |
ISBN (Trykt) | 978-1-5386-6760-6 |
ISBN (Elektronisk) | 978-1-5386-6759-0 |
DOI | |
Status | Udgivet - sep. 2018 |
Begivenhed | 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Stockholm, Sverige Varighed: 26 sep. 2018 → 28 sep. 2018 |
Konference
Konference | 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
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Land/Område | Sverige |
By | Stockholm |
Periode | 26/09/2018 → 28/09/2018 |
Navn | International Workshop on Thermal Investigations of ICs and Systems |
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ISSN | 2474-1515 |
Fingeraftryk
Dyk ned i forskningsemnerne om 'Non-uniform Temperature Distribution Implications on Thermal Analysis Accuracy of Si IGBTs and SiC MOSFETs'. Sammen danner de et unikt fingeraftryk.Projekter
- 1 Afsluttet
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning