Online Condition Monitoring of Bond Wire Degradation in Inverter Operation

Fernando Gonzalez-Hernando; Jon San-Sebastian; Asier Garcia-Bediaga; Manuel Arias; Francesco Iannuzzo; Frede Blaabjerg

doi:10.1109/ECCE.2018.8558460

Online Condition Monitoring of Bond Wire Degradation in Inverter Operation

Fernando Gonzalez-Hernando, Jon San-Sebastian, Asier Garcia-Bediaga, Manuel Arias, Francesco Iannuzzo, Frede Blaabjerg

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

6 Citationer (Scopus)

255 Downloads (Pure)

Abstract

This paper presents a condition monitoring system for the online detection of the degradation of power switches in medium power inverter topologies. The monitoring, suitable for MOSFET and IGBTs, is based on the measurement of both on-state voltage of the semiconductor and the voltage drop in the bond wires. Through these measurements, the main failure mechanisms, been these the degradation of the solder joints and the bond wire connections, can be anticipated. The proposed system has been implemented in a setup and tests have been performed in static conditions and as an inverter, with a switching frequency up to 5 kHz. Moreover, this paper proposes an alternative routine appropriate for those applications in which a higher switching frequency is required. This routine has been validated with the DUT switching at 50 kHz. In all the circumstances, the prototype proved its efficiency to measure accurately and its capability to detect the bond wire degradation.

Originalsprog	Engelsk
Titel	Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018)
Antal sider	7
Udgivelsessted	USA
Forlag	IEEE Press
Publikationsdato	sep. 2018
Sider	4115 - 4121
ISBN (Trykt)	978-1-4799-7313-2
ISBN (Elektronisk)	978-1-4799-7312-5
DOI	https://doi.org/10.1109/ECCE.2018.8558460
Status	Udgivet - sep. 2018
Begivenhed	IEEE Energy Conversion Congress & Exposition ECCE 2018 - Portland, USA Varighed: 23 sep. 2018 → 27 sep. 2018 http://www.ieee-ecce.org/2018/

Konference

Konference	IEEE Energy Conversion Congress & Exposition ECCE 2018
Land/Område	USA
By	Portland
Periode	23/09/2018 → 27/09/2018
Internetadresse	http://www.ieee-ecce.org/2018/

Navn	IEEE Energy Conversion Congress and Exposition
ISSN	2329-3721

Adgang til dokumentet

10.1109/ECCE.2018.8558460

ECCE_2018_v1Accepteret manuskript, 2,25 MB

AUB Link

Søg efter materialet i Aalborg Universitetsbiblioteks søgemaskine

Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning

Citationsformater

@inproceedings{17fa066253304b5585b199913f57b192,

title = "Online Condition Monitoring of Bond Wire Degradation in Inverter Operation",

abstract = "This paper presents a condition monitoring system for the online detection of the degradation of power switches in medium power inverter topologies. The monitoring, suitable for MOSFET and IGBTs, is based on the measurement of both on-state voltage of the semiconductor and the voltage drop in the bond wires. Through these measurements, the main failure mechanisms, been these the degradation of the solder joints and the bond wire connections, can be anticipated. The proposed system has been implemented in a setup and tests have been performed in static conditions and as an inverter, with a switching frequency up to 5 kHz. Moreover, this paper proposes an alternative routine appropriate for those applications in which a higher switching frequency is required. This routine has been validated with the DUT switching at 50 kHz. In all the circumstances, the prototype proved its efficiency to measure accurately and its capability to detect the bond wire degradation.",

author = "Fernando Gonzalez-Hernando and Jon San-Sebastian and Asier Garcia-Bediaga and Manuel Arias and Francesco Iannuzzo and Frede Blaabjerg",

year = "2018",

month = sep,

doi = "10.1109/ECCE.2018.8558460",

language = "English",

isbn = "978-1-4799-7313-2",

series = "IEEE Energy Conversion Congress and Exposition",

pages = "4115 -- 4121",

booktitle = "Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018)",

publisher = "IEEE Press",

note = "IEEE Energy Conversion Congress & Exposition ECCE 2018 ; Conference date: 23-09-2018 Through 27-09-2018",

url = "http://www.ieee-ecce.org/2018/",

}

Gonzalez-Hernando, F, San-Sebastian, J, Garcia-Bediaga, A, Arias, M, Iannuzzo, F & Blaabjerg, F 2018, Online Condition Monitoring of Bond Wire Degradation in Inverter Operation. i Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). IEEE Press, USA, IEEE Energy Conversion Congress and Exposition, s. 4115 - 4121, IEEE Energy Conversion Congress & Exposition ECCE 2018, Portland, Oregon, USA, 23/09/2018. https://doi.org/10.1109/ECCE.2018.8558460

Online Condition Monitoring of Bond Wire Degradation in Inverter Operation. / Gonzalez-Hernando, Fernando; San-Sebastian, Jon; Garcia-Bediaga, Asier et al.
Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press, 2018. s. 4115 - 4121 (IEEE Energy Conversion Congress and Exposition).

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

TY - GEN

T1 - Online Condition Monitoring of Bond Wire Degradation in Inverter Operation

AU - Gonzalez-Hernando, Fernando

AU - San-Sebastian, Jon

AU - Garcia-Bediaga, Asier

AU - Arias, Manuel

AU - Iannuzzo, Francesco

AU - Blaabjerg, Frede

PY - 2018/9

Y1 - 2018/9

N2 - This paper presents a condition monitoring system for the online detection of the degradation of power switches in medium power inverter topologies. The monitoring, suitable for MOSFET and IGBTs, is based on the measurement of both on-state voltage of the semiconductor and the voltage drop in the bond wires. Through these measurements, the main failure mechanisms, been these the degradation of the solder joints and the bond wire connections, can be anticipated. The proposed system has been implemented in a setup and tests have been performed in static conditions and as an inverter, with a switching frequency up to 5 kHz. Moreover, this paper proposes an alternative routine appropriate for those applications in which a higher switching frequency is required. This routine has been validated with the DUT switching at 50 kHz. In all the circumstances, the prototype proved its efficiency to measure accurately and its capability to detect the bond wire degradation.

AB - This paper presents a condition monitoring system for the online detection of the degradation of power switches in medium power inverter topologies. The monitoring, suitable for MOSFET and IGBTs, is based on the measurement of both on-state voltage of the semiconductor and the voltage drop in the bond wires. Through these measurements, the main failure mechanisms, been these the degradation of the solder joints and the bond wire connections, can be anticipated. The proposed system has been implemented in a setup and tests have been performed in static conditions and as an inverter, with a switching frequency up to 5 kHz. Moreover, this paper proposes an alternative routine appropriate for those applications in which a higher switching frequency is required. This routine has been validated with the DUT switching at 50 kHz. In all the circumstances, the prototype proved its efficiency to measure accurately and its capability to detect the bond wire degradation.

U2 - 10.1109/ECCE.2018.8558460

DO - 10.1109/ECCE.2018.8558460

M3 - Article in proceeding

SN - 978-1-4799-7313-2

T3 - IEEE Energy Conversion Congress and Exposition

SP - 4115

EP - 4121

BT - Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018)

PB - IEEE Press

CY - USA

T2 - IEEE Energy Conversion Congress & Exposition ECCE 2018

Y2 - 23 September 2018 through 27 September 2018

ER -

Online Condition Monitoring of Bond Wire Degradation in Inverter Operation

Abstract

Konference

Adgang til dokumentet

AUB Link

Fingeraftryk

Projekter

Center Of Reliable Power Electronics (CORPE)

Citationsformater