Optimized Thermal Management System of Modular Multilevel Converter for HVDC applications

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Abstract

The dynamical behavior of temperature is becoming a critical design consideration for the Modular Multilevel Converter (MMC). Investigation of an advanced control structure for Grid Connected-Modular Multilevel Converter (GC-MMC) is proposed in this paper. To achieve this goal, an non-linear model of MMC regarding considering of negative and positive sequence components with thermal dynamics has been presented. Then, due to existence of unbalance voltage faults in distribution grid, non-linarites and uncertainties in model, adaptive robust current controller which is composed of sliding mode and fuzzy control, is developed for GC-MMC. Finally, numerical results are given in order to show the dynamic performance of GC-MMC prototype under normal and unbalanced fault conditions. They illustrate the proposed current controllers could keep the MMC stable under different conditions and thermal performance of MMC is given.
OriginalsprogEngelsk
TitelProceedings of the 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Antal sider5
UdgivelsesstedGothenburg, Sweden
ForlagIEEE Press
Publikationsdatojun. 2017
Sider17-21
ISBN (Trykt)978-1-5386-3054-9
StatusUdgivet - jun. 2017
Begivenhed2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Gothenburg, Sverige
Varighed: 18 jun. 201720 jun. 2017

Konference

Konference2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Land/OmrådeSverige
ByGothenburg
Periode18/06/201720/06/2017

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