Performance Benchmark of Bypassing Techniques for Photovoltaic Modules

Kamran Ali Khan Niazi, Yongheng Yang, Hassan Abbas Khan, Dezso Séra

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2 Citationer (Scopus)

Abstrakt

The deployment of solar photovoltaic (PV) systems is increasing. The performance degradation of PV systems can happen, which is potentially induced by partial shading, also referred to as mismatch faults. Conventional PV modules are connected in series and are sensitive to mismatch faults. Bypass methods and other solutions are thus used to reduce the mismatch effect. This paper compares the performances of the bypassing techniques using traditional (Schottky) bypassing diodes with smart bypassing diodes (SBD). The benchmarking results show that the SBD can be employed to improve the performance during shading in PV systems. More specifically, the use of SBDs with series-connected MOSFETs leads to a reduction of the reverse voltage with a higher output power under various shading conditions, when compared to the case with traditional bypassing diodes. The reduction in the reserve voltage contributes to lowered temperature in shaded cells, and thus increases the reliability of the PV modules.
OriginalsprogEngelsk
Titel34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Antal sider5
ForlagIEEE Press
Publikationsdato24 maj 2019
Sider3164-3168
Artikelnummer8722259
ISBN (Elektronisk)9781538683309
DOI
StatusUdgivet - 24 maj 2019
Begivenhed34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, USA
Varighed: 17 mar. 201921 mar. 2019

Konference

Konference34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
LandUSA
ByAnaheim
Periode17/03/201921/03/2019
SponsorIEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)

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Citationsformater

Niazi, K. A. K., Yang, Y., Khan, H. A., & Séra, D. (2019). Performance Benchmark of Bypassing Techniques for Photovoltaic Modules. I 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 (s. 3164-3168). [8722259] IEEE Press. https://doi.org/10.1109/APEC.2019.8722259