Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings

U. M. Choi; S. Jørgensen; F. Iannuzzo; F. Blaabjerg

doi:10.1016/j.microrel.2018.07.002

Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings

U. M. Choi^*, S. Jørgensen, F. Iannuzzo, F. Blaabjerg

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Publikation: Bidrag til tidsskrift › Konferenceartikel i tidsskrift › Forskning › peer review

4 Citationer (Scopus)

152 Downloads (Pure)

Abstrakt

In this paper, an effect of junction temperature swings (ΔTj) on reliability of IGBT modules is studied with 600 V, 30 A, transfer molded power modules. This study is based on power cycling test results of 18 IGBT modules under three different junction temperature swings, namely 40 °C, 60 °C and 70 °C, by means of an advanced power cycler. The advanced power cycler allows performing power cycling tests under similar conditions of IGBT modules in power electronics applications. This paper presents post-failure analysis of the tested IGBT modules of interest in order to investigate the failure mechanism and also to compare results under different Tj. Further, a lifetime factor in respect to ΔTj is modeled with different lifetime definitions and confidence levels. This paper enables a better understanding of the junction temperature swing-related failure mechanisms and reliability performance of transfer molded IGBT modules for power electronics applications.

Originalsprog	Engelsk
Tidsskrift	Microelectronics Reliability
Vol/bind	88-90
Sider (fra-til)	788-794
Antal sider	7
ISSN	0026-2714
DOI	https://doi.org/10.1016/j.microrel.2018.07.002
Status	Udgivet - sep. 2018
Begivenhed	29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Danmark Varighed: 1 okt. 2018 → 5 okt. 2018 Konferencens nummer: 29th http://www.esref2018conf.org/

Konference

Konference	29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Nummer	29th
Lokation	AKKC
Land/Område	Danmark
By	Aalborg
Periode	01/10/2018 → 05/10/2018
Internetadresse	http://www.esref2018conf.org/

Adgang til dokumentet

10.1016/j.microrel.2018.07.002

SubmittedAccepteret manuskript, 1,34 MBLicens: CC BY-NC-ND 4.0

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http://www.scopus.com/inward/record.url?scp=85054012167&partnerID=8YFLogxK

Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning

Citationsformater

@inproceedings{7e75a9bf675f4a4b9f30e43de24ac0f1,

title = "Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings",

abstract = "In this paper, an effect of junction temperature swings (ΔTj) on reliability of IGBT modules is studied with 600 V, 30 A, transfer molded power modules. This study is based on power cycling test results of 18 IGBT modules under three different junction temperature swings, namely 40 °C, 60 °C and 70 °C, by means of an advanced power cycler. The advanced power cycler allows performing power cycling tests under similar conditions of IGBT modules in power electronics applications. This paper presents post-failure analysis of the tested IGBT modules of interest in order to investigate the failure mechanism and also to compare results under different Tj. Further, a lifetime factor in respect to ΔTj is modeled with different lifetime definitions and confidence levels. This paper enables a better understanding of the junction temperature swing-related failure mechanisms and reliability performance of transfer molded IGBT modules for power electronics applications.",

author = "Choi, {U. M.} and S. J{\o}rgensen and F. Iannuzzo and F. Blaabjerg",

year = "2018",

month = sep,

doi = "10.1016/j.microrel.2018.07.002",

language = "English",

volume = "88-90",

pages = "788--794",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Pergamon Press",

note = "29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2018 ; Conference date: 01-10-2018 Through 05-10-2018",

url = "http://www.esref2018conf.org/",

}

TY - GEN

T1 - Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings

AU - Choi, U. M.

AU - Jørgensen, S.

AU - Iannuzzo, F.

AU - Blaabjerg, F.

N1 - Conference code: 29th

PY - 2018/9

Y1 - 2018/9

N2 - In this paper, an effect of junction temperature swings (ΔTj) on reliability of IGBT modules is studied with 600 V, 30 A, transfer molded power modules. This study is based on power cycling test results of 18 IGBT modules under three different junction temperature swings, namely 40 °C, 60 °C and 70 °C, by means of an advanced power cycler. The advanced power cycler allows performing power cycling tests under similar conditions of IGBT modules in power electronics applications. This paper presents post-failure analysis of the tested IGBT modules of interest in order to investigate the failure mechanism and also to compare results under different Tj. Further, a lifetime factor in respect to ΔTj is modeled with different lifetime definitions and confidence levels. This paper enables a better understanding of the junction temperature swing-related failure mechanisms and reliability performance of transfer molded IGBT modules for power electronics applications.

AB - In this paper, an effect of junction temperature swings (ΔTj) on reliability of IGBT modules is studied with 600 V, 30 A, transfer molded power modules. This study is based on power cycling test results of 18 IGBT modules under three different junction temperature swings, namely 40 °C, 60 °C and 70 °C, by means of an advanced power cycler. The advanced power cycler allows performing power cycling tests under similar conditions of IGBT modules in power electronics applications. This paper presents post-failure analysis of the tested IGBT modules of interest in order to investigate the failure mechanism and also to compare results under different Tj. Further, a lifetime factor in respect to ΔTj is modeled with different lifetime definitions and confidence levels. This paper enables a better understanding of the junction temperature swing-related failure mechanisms and reliability performance of transfer molded IGBT modules for power electronics applications.

UR - http://www.scopus.com/inward/record.url?scp=85054012167&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2018.07.002

DO - 10.1016/j.microrel.2018.07.002

M3 - Conference article in Journal

AN - SCOPUS:85054012167

SN - 0026-2714

VL - 88-90

SP - 788

EP - 794

JO - Microelectronics Reliability

JF - Microelectronics Reliability

T2 - 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis

Y2 - 1 October 2018 through 5 October 2018

ER -

Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings

Abstrakt

Konference

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AUB Link

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Fingeraftryk

Projekter

Center Of Reliable Power Electronics (CORPE)

Citationsformater