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Abstract
In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.
Originalsprog | Engelsk |
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Titel | Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016 |
Antal sider | 7 |
Forlag | IEEE Press |
Publikationsdato | sep. 2016 |
ISBN (Elektronisk) | 978-1-5090-0737-0 |
DOI | |
Status | Udgivet - sep. 2016 |
Begivenhed | 8th Annual IEEE Energy Conversion Congress & Exposition: ECCE 2016 - Milwaukee, WI, USA Varighed: 18 sep. 2016 → 22 sep. 2016 http://www.ieee-ecce.org/ |
Konference
Konference | 8th Annual IEEE Energy Conversion Congress & Exposition |
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Land/Område | USA |
By | Milwaukee, WI |
Periode | 18/09/2016 → 22/09/2016 |
Sponsor | IEEE, IEEE Industry Applications Society (IAS), IEEE Power Electronics and Industry Applications Societies (PELS) |
Internetadresse |
Fingeraftryk
Dyk ned i forskningsemnerne om 'Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules'. Sammen danner de et unikt fingeraftryk.Projekter
- 1 Afsluttet
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning