Reliability design of 10 kV SiC-MOSFET power modules based on thermo-mechanical simulations

Masaki Takahashi

doi:10.54337/aau756453048

Reliability design of 10 kV SiC-MOSFET power modules based on thermo-mechanical simulations

Masaki Takahashi

Publikation: Ph.d.-afhandling

211 Downloads (Pure)

Abstract

In this PhD thesis, the thermo-mechanical reliability performance of 10 kV SiC-MOSFET power modules, which is a promising power electronics for medium voltage applications, is evaluated for power cycling and thermal cycling tests using 3D thermo-mechanical simulation.
Then, the thermo-mechanical characteristics of them are clarified and a digital design method to improve the thermo-mechanical reliability is proposed using 3D modeling.

Originalsprog	Engelsk
Vejledere	Munk-Nielsen, Stig, Hovedvejleder Jørgensen, Asger Bjørn, Bivejleder
Udgiver	Aalborg University Open Publishing
ISBN'er, elektronisk	978-87-85239-30-3
DOI	https://doi.org/10.54337/aau756453048
Status	Udgivet - 2024

Adgang til dokumentet

10.54337/aau756453048

PHD_MT_ONLINEForlagets udgivne version, 41,2 MB

AUB Link

Søg efter materialet i Aalborg Universitetsbiblioteks søgemaskine

1 Afsluttet
1 Igangværende

CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S. (PI (principal investigator)), Jørgensen, A. B. (CoPI), Uhrenfeldt, C. (CoPI), Beczkowski, S. M. (Projektdeltager), Ahmad, F. (Projektdeltager), Meinert, J. D. (Projektdeltager), Kubulus, P. P. (Projektdeltager), Takahashi, M. (Projektdeltager), Sun, Z. (Projektdeltager), Wang, R. (Projektdeltager), Gao, Y. (Projektdeltager), Zäch, M. R. (Projektdeltager), Meyer, S. (Projektdeltager), Liccardi, S. (Projektdeltager), Kristensen, N. H. (Projektdeltager) & Steffensen, B. (Projektkoordinator)
Poul Due Jensens Fond
01/01/2021 → 31/12/2026
Projekter: Projekt › Forskning
Developing the Novel Reliability Design Method with 3D-simulation of SiC Power Module
Takahashi, M. (PI (principal investigator)), Uhrenfeldt, C. (Supervisor), Munk-Nielsen, S. (Supervisor) & Jørgensen, A. B. (Supervisor)
01/10/2021 → 30/09/2024
Projekter: Projekt › Ph.d.-projekt

Kyushu Institute of Technology
Takahashi, M. (Gæsteforsker)
1 okt. 2023 → 31 dec. 2023
Aktivitet: Gæsteophold ved andre institutioner

APEC 2023 Outstanding poster award
Takahashi, M. (Modtager), Jørgensen, J. K. (Modtager), Jørgensen, A. B. (Modtager), Munk-Nielsen, S. (Modtager) & Uhrenfeldt, C. (Modtager), 23 mar. 2023
Pris: Konferencepriser

Citationsformater

@misc{c1a143edfe1446d9965e846706c4963b,

title = "Reliability design of 10 kV SiC-MOSFET power modules based on thermo-mechanical simulations",

abstract = "In this PhD thesis, the thermo-mechanical reliability performance of 10 kV SiC-MOSFET power modules, which is a promising power electronics for medium voltage applications, is evaluated for power cycling and thermal cycling tests using 3D thermo-mechanical simulation.Then, the thermo-mechanical characteristics of them are clarified and a digital design method to improve the thermo-mechanical reliability is proposed using 3D modeling.",

author = "Masaki Takahashi",

year = "2024",

doi = "10.54337/aau756453048",

language = "English",

series = "Ph.d.-serien for Det Ingeni{\o}r- og Naturvidenskabelige Fakultet, Aalborg Universitet",

publisher = "Aalborg University Open Publishing",

}

TY - GEN

T1 - Reliability design of 10 kV SiC-MOSFET power modules based on thermo-mechanical simulations

AU - Takahashi, Masaki

PY - 2024

Y1 - 2024

N2 - In this PhD thesis, the thermo-mechanical reliability performance of 10 kV SiC-MOSFET power modules, which is a promising power electronics for medium voltage applications, is evaluated for power cycling and thermal cycling tests using 3D thermo-mechanical simulation.Then, the thermo-mechanical characteristics of them are clarified and a digital design method to improve the thermo-mechanical reliability is proposed using 3D modeling.

AB - In this PhD thesis, the thermo-mechanical reliability performance of 10 kV SiC-MOSFET power modules, which is a promising power electronics for medium voltage applications, is evaluated for power cycling and thermal cycling tests using 3D thermo-mechanical simulation.Then, the thermo-mechanical characteristics of them are clarified and a digital design method to improve the thermo-mechanical reliability is proposed using 3D modeling.

U2 - 10.54337/aau756453048

DO - 10.54337/aau756453048

M3 - PhD thesis

T3 - Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet

PB - Aalborg University Open Publishing

ER -

Reliability design of 10 kV SiC-MOSFET power modules based on thermo-mechanical simulations

Abstract

Adgang til dokumentet

AUB Link

Fingeraftryk

Projekter

CoDE: Center of Digitalized Electronics (CoDE)

Developing the Novel Reliability Design Method with 3D-simulation of SiC Power Module

Aktiviteter

Kyushu Institute of Technology

Priser

APEC 2023 Outstanding poster award

Citationsformater