Reliability-oriented environmental thermal stress analysis of fuses in power electronics

A. S. Bahman*, F. Iannuzzo, T. Holmgaard, R. Ø. Nielsen, F. Blaabjerg

*Kontaktforfatter

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

11 Citationer (Scopus)

Abstract

This paper investigates the thermo-mechanical stress experienced by axial lead fuses used in power electronics. Based on some experience, the approach used in this paper is pure thermal cycling, and the found failure mechanisms have been investigated through X-ray imaging. A two-step analysis, i.e. microscopic inspection and FEM thermo-mechanical simulation have been carried out based on the real geometry, including core and isolation materials, as well as the arc quenching one, which is typically quartz sand. The failure mechanism hypothesis of higher temperature variation at the end hole of the fuse element has been confirmed thanks to the analysis performed. Finally, the fatigue analysis is presented obtained by FEM-based fatigue tool.
OriginalsprogEngelsk
TidsskriftMicroelectronics Reliability
Vol/bind76-77
Sider (fra-til)25-30
Antal sider6
ISSN0026-2714
DOI
StatusUdgivet - sep. 2017
Begivenhed28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) - Bordeaux, Frankrig
Varighed: 25 sep. 201728 sep. 2017

Konference

Konference28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)
Land/OmrådeFrankrig
ByBordeaux
Periode25/09/201728/09/2017

Fingeraftryk

Dyk ned i forskningsemnerne om 'Reliability-oriented environmental thermal stress analysis of fuses in power electronics'. Sammen danner de et unikt fingeraftryk.

Citationsformater