Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules

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5 Citationer (Scopus)
43 Downloads (Pure)

Abstrakt

In the reliability evaluation of power electronic systems, one of the challenges is to model the thermal profiles across multiple time scales, i.e., from switching cycles at nano- or micro-seconds to annual or even longer-time mission profiles. Without consideration of the dissimilarity of thermal behaviors under different time scales, a single thermal model usually leads to either considerable modeling errors or heavy computational burden. Based on the frequency response of thermal impedances, this paper proposes a novel and simplified thermal model to analyze mission profiles with multiple time scales. It enables a computational-efficient thermal stress analysis for power semiconductors, including the thermal coupling in device packages. The theoretical results are verified by experimental testing.
OriginalsprogEngelsk
TitelProceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)
Antal sider6
ForlagIEEE Press
Publikationsdato24 maj 2019
Sider319-324
Artikelnummer8721898
ISBN (Elektronisk)9781538683309
DOI
StatusUdgivet - 24 maj 2019
Begivenhed34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, USA
Varighed: 17 mar. 201921 mar. 2019

Konference

Konference34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Land/OmrådeUSA
ByAnaheim
Periode17/03/201921/03/2019
SponsorIEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)
NavnI E E E Applied Power Electronics Conference and Exposition. Conference Proceedings
ISSN1048-2334

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