TY - GEN
T1 - Temperature Control of IGBTs by Thermoelectric Cooler
AU - Rezaniakolaei, Alireza
PY - 2019/9
Y1 - 2019/9
N2 - High operation temperature prevents increasing current through power electronic devices, and high operating temperature reduces lifetime of power electronic modules. Moreover, conventional heavy and bulky heat sinks reduce cooling efficiency and system flexibility; therefore, temperature of power electronic cells cannot be controlled with fast response. This study aims active temperature control solution to overcome thermal overloading constraint in power electronic semiconductor chip. The active cooling technology comprises thermoelectric cooler (TEC), thermally connected to the semiconductor chip and high performance heat sink. The results show that, by thermoelectric cooling the peak temperature zone moves from the semiconductor chip to the heat sink. Furthermore, optimal current density across the TEC module is explored in the current study in order to minimize operating temperature on the power electronics semiconductor chip.
AB - High operation temperature prevents increasing current through power electronic devices, and high operating temperature reduces lifetime of power electronic modules. Moreover, conventional heavy and bulky heat sinks reduce cooling efficiency and system flexibility; therefore, temperature of power electronic cells cannot be controlled with fast response. This study aims active temperature control solution to overcome thermal overloading constraint in power electronic semiconductor chip. The active cooling technology comprises thermoelectric cooler (TEC), thermally connected to the semiconductor chip and high performance heat sink. The results show that, by thermoelectric cooling the peak temperature zone moves from the semiconductor chip to the heat sink. Furthermore, optimal current density across the TEC module is explored in the current study in order to minimize operating temperature on the power electronics semiconductor chip.
UR - http://www.scopus.com/inward/record.url?scp=85077980875&partnerID=8YFLogxK
U2 - 10.1109/THERMINIC.2019.8923735
DO - 10.1109/THERMINIC.2019.8923735
M3 - Article in proceeding
SN - 978-1-7281-2078-2
T3 - International Workshop on Thermal Investigations of ICs and Systems
BT - THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems
PB - IEEE Press
T2 - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Y2 - 25 September 2019 through 27 September 2019
ER -