Temperature Management of a Semiconductor Chip

Alireza Rezaniakolaei (Opfinder), Lasse Rosendahl (Opfinder), Maysam Karimirad (Opfinder), Ali Asghar Enkeshafi (Opfinder)

Publikation: Patent

Abstrakt

The invention relates to a method of controlling thermal stress of a semiconductor chip, the method comprises the steps of: establishing a modular frequency of the semiconductor chip and thereby a thermal profile of the semiconductor chip and establishing a pulsing current controlling the thermal profile of a thermoelectric cooling device thermally connected to the semiconductor chip. Wherein the pulsing current is generated in response to the modular frequency, so that a super cooling period of the thermal profile of the thermoelectric cooling device is at least partly overlapping a temperature increasing period of the thermal profile of the semiconductor chip,anda recovery period of the thermal profile of the thermoelectric cooling device is at least partly overlapping a temperature decreasing period of the thermal profile of the semiconductor chip.
OriginalsprogEngelsk
IPCH01L 23/38 (2006.01) ,H01L 35/30 (2006.01) ,H01L 35/32 (2006.01)
PatentnummerWO2019210923
Journaliseringsdato30/04/2019
LandDanmark
StatusUdgivet - nov. 2019

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