Test bench for thermal cycling of 10 kV silicon carbide power modules

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Resumé

This paper presents a test bench for lifetime investigation of 10 kV silicon carbide power modules. The test bench subjects high voltage switching operation to the modules while power cycling. Thus both a thermal and electrical operating point is emulated. The power cycling setup features offline measurement of on-state voltages and direct real-time measurement of die surface temperatures, enabled by fiber optical sensors, which are built into the power modules. A thermal model of the module prototypes, based on the temperature measurements, is established. Independent verification steps have been made to validate the performance of the on-state voltage measurement and the thermal model. Issues are revealed in the form of common mode currents in gate drive supply, which should be remedied. Finally a new operating point for power cycling is suggested to better stress the power modules.
OriginalsprogEngelsk
TitelProceedings of 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)
Antal sider8
Udgivelses stedKarlsruhe, Germany
ForlagIEEE
Publikationsdatosep. 2016
ISBN (Elektronisk)978-9-0758-1524-5
DOI
StatusUdgivet - sep. 2016
BegivenhedEPE'16 - ECCE: 18th European Conference on Power Electronics and Applications - Karlsruhe Town Hall (Stadthalle), Karlsruhe, Tyskland
Varighed: 5 sep. 20169 sep. 2016
Konferencens nummer: 18
http://www.epe2016.com/

Konference

KonferenceEPE'16 - ECCE: 18th European Conference on Power Electronics and Applications
Nummer18
LokationKarlsruhe Town Hall (Stadthalle)
LandTyskland
ByKarlsruhe
Periode05/09/201609/09/2016
Internetadresse

Fingerprint

Thermal cycling
Silicon carbide
Voltage measurement
Fiber optic sensors
Electric potential
Time measurement
Temperature measurement
Hot Temperature
Temperature

Citer dette

Sønderskov, S. D., Jørgensen, A. B., Maarbjerg, A. E., Frederiksen, K. L., Munk-Nielsen, S., Beczkowski, S., & Uhrenfeldt, C. (2016). Test bench for thermal cycling of 10 kV silicon carbide power modules. I Proceedings of 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe) Karlsruhe, Germany: IEEE. https://doi.org/10.1109/EPE.2016.7695328
Sønderskov, Simon Dyhr ; Jørgensen, Asger Bjørn ; Maarbjerg, Anders Eggert ; Frederiksen, Kristian Linding ; Munk-Nielsen, Stig ; Beczkowski, Szymon ; Uhrenfeldt, Christian. / Test bench for thermal cycling of 10 kV silicon carbide power modules. Proceedings of 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe). Karlsruhe, Germany : IEEE, 2016.
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title = "Test bench for thermal cycling of 10 kV silicon carbide power modules",
abstract = "This paper presents a test bench for lifetime investigation of 10 kV silicon carbide power modules. The test bench subjects high voltage switching operation to the modules while power cycling. Thus both a thermal and electrical operating point is emulated. The power cycling setup features offline measurement of on-state voltages and direct real-time measurement of die surface temperatures, enabled by fiber optical sensors, which are built into the power modules. A thermal model of the module prototypes, based on the temperature measurements, is established. Independent verification steps have been made to validate the performance of the on-state voltage measurement and the thermal model. Issues are revealed in the form of common mode currents in gate drive supply, which should be remedied. Finally a new operating point for power cycling is suggested to better stress the power modules.",
keywords = "Reliability, Silicon Carbide (SiC), Power cycling",
author = "S{\o}nderskov, {Simon Dyhr} and J{\o}rgensen, {Asger Bj{\o}rn} and Maarbjerg, {Anders Eggert} and Frederiksen, {Kristian Linding} and Stig Munk-Nielsen and Szymon Beczkowski and Christian Uhrenfeldt",
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Sønderskov, SD, Jørgensen, AB, Maarbjerg, AE, Frederiksen, KL, Munk-Nielsen, S, Beczkowski, S & Uhrenfeldt, C 2016, Test bench for thermal cycling of 10 kV silicon carbide power modules. i Proceedings of 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe). IEEE, Karlsruhe, Germany, Karlsruhe, Tyskland, 05/09/2016. https://doi.org/10.1109/EPE.2016.7695328

Test bench for thermal cycling of 10 kV silicon carbide power modules. / Sønderskov, Simon Dyhr; Jørgensen, Asger Bjørn; Maarbjerg, Anders Eggert ; Frederiksen, Kristian Linding; Munk-Nielsen, Stig; Beczkowski, Szymon; Uhrenfeldt, Christian.

Proceedings of 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe). Karlsruhe, Germany : IEEE, 2016.

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

TY - GEN

T1 - Test bench for thermal cycling of 10 kV silicon carbide power modules

AU - Sønderskov, Simon Dyhr

AU - Jørgensen, Asger Bjørn

AU - Maarbjerg, Anders Eggert

AU - Frederiksen, Kristian Linding

AU - Munk-Nielsen, Stig

AU - Beczkowski, Szymon

AU - Uhrenfeldt, Christian

PY - 2016/9

Y1 - 2016/9

N2 - This paper presents a test bench for lifetime investigation of 10 kV silicon carbide power modules. The test bench subjects high voltage switching operation to the modules while power cycling. Thus both a thermal and electrical operating point is emulated. The power cycling setup features offline measurement of on-state voltages and direct real-time measurement of die surface temperatures, enabled by fiber optical sensors, which are built into the power modules. A thermal model of the module prototypes, based on the temperature measurements, is established. Independent verification steps have been made to validate the performance of the on-state voltage measurement and the thermal model. Issues are revealed in the form of common mode currents in gate drive supply, which should be remedied. Finally a new operating point for power cycling is suggested to better stress the power modules.

AB - This paper presents a test bench for lifetime investigation of 10 kV silicon carbide power modules. The test bench subjects high voltage switching operation to the modules while power cycling. Thus both a thermal and electrical operating point is emulated. The power cycling setup features offline measurement of on-state voltages and direct real-time measurement of die surface temperatures, enabled by fiber optical sensors, which are built into the power modules. A thermal model of the module prototypes, based on the temperature measurements, is established. Independent verification steps have been made to validate the performance of the on-state voltage measurement and the thermal model. Issues are revealed in the form of common mode currents in gate drive supply, which should be remedied. Finally a new operating point for power cycling is suggested to better stress the power modules.

KW - Reliability

KW - Silicon Carbide (SiC)

KW - Power cycling

U2 - 10.1109/EPE.2016.7695328

DO - 10.1109/EPE.2016.7695328

M3 - Article in proceeding

BT - Proceedings of 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)

PB - IEEE

CY - Karlsruhe, Germany

ER -

Sønderskov SD, Jørgensen AB, Maarbjerg AE, Frederiksen KL, Munk-Nielsen S, Beczkowski S et al. Test bench for thermal cycling of 10 kV silicon carbide power modules. I Proceedings of 2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe). Karlsruhe, Germany: IEEE. 2016 https://doi.org/10.1109/EPE.2016.7695328