The Impact of Mission Profile Models on the Predicted Lifetime of IGBT Modules in the Modular Multilevel Converter

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13 Citationer (Scopus)
198 Downloads (Pure)

Abstrakt

The reliability aspect study of Modular Multilevel Converter (MMC) is of great interest in industry applications, such as offshore wind. Lifetime prediction of key components is an important tool to design MMC with fulfilled reliability specifications. While many efforts have been made to the lifetime prediction of IGBT modules in renewable energy applications by considering long-term
varying operation conditions (i.e., mission profile), the justifications of using the associated mission profiles are still missed. This paper investigates the impact of mission profile data resolutions and electrical power modeling methods on the estimated lifetime of IGBT modules in an MMC for offshore wind power application. In a 30 MW MMC case study, an annual wind speed profile with a resolution of 1 s/data, 10 minute/data, and 1 hour/data are considered, respectively. A method to re-generate higher resolution wind speed data from lower resolution data is introduced as well. Based on the wind speed data, IEC 61400-12-1 power curve model and a wind speed-power stochastic model are compared as well. Five mission profile modeling scenarios are compared in terms of the predicted lifetime of the IGBT modules used in the MMC, resulting in significant differences. The study serves as a first step to quantify the impact of mission profile modeling on lifetime prediction, and to provide a guideline on mission profile collection for the presented application.
OriginalsprogEngelsk
TitelProceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017
Antal sider6
ForlagIEEE Press
Publikationsdatookt. 2017
Sider7980-7985
ISBN (Elektronisk)978-1-5386-1127-2
DOI
StatusUdgivet - okt. 2017
Begivenhed43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 - Beijing, Kina
Varighed: 29 okt. 20171 nov. 2017

Konference

Konference43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017
LandKina
ByBeijing
Periode29/10/201701/11/2017
SponsorChinese Association of Automation (CAA), Chinese Power Supply Society, et al., IEEE Industrial Electronics Society (IES), Systems Engineering Society of China, The Institute of Electrical and Electronics Engineers (IEEE)

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    • 1 Organisering af eller deltagelse i konference

    43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017

    Zhongxu Wang (Deltager)

    29 okt. 20171 nov. 2017

    Aktivitet: Deltagelse i faglig begivenhedOrganisering af eller deltagelse i konference

    Publikation

    • 13 Citationer
    • 1 Ph.d.-afhandling

    Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

    Wang, Z., 2019, Aalborg Universitetsforlag. 111 s. (Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet).

    Publikation: Bog/antologi/afhandling/rapportPh.d.-afhandlingForskning

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    Citationsformater

    Zhang, Y., Wang, H., Wang, Z., Yang, Y., & Blaabjerg, F. (2017). The Impact of Mission Profile Models on the Predicted Lifetime of IGBT Modules in the Modular Multilevel Converter. I Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 (s. 7980-7985). IEEE Press. https://doi.org/10.1109/IECON.2017.8217399