Thermal cycling characterization of integrated GaN power module

Zhongchao Sun; Masaki Takahashi; Stig Munk-Nielsen; Asger Bjørn Jørgensen

doi:10.23919/EPE23ECCEEurope58414.2023.10264265

Thermal cycling characterization of integrated GaN power module

Zhongchao Sun^*, Masaki Takahashi, Stig Munk-Nielsen, Asger Bjørn Jørgensen

^*Kontaktforfatter

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

2 Citationer (Scopus)

22 Downloads (Pure)

Abstract

A thermal cycling test is developed on a low parasitic inductance integrated GaN power module by monitoring the electrical and thermal parameters. The failure points of DBC and solder attach leading to increased thermal resistance are located, and the failure mechanism is analyzed based on Scanning Acoustic Microscope observation.

Originalsprog	Engelsk
Titel	2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe
Antal sider	7
Forlag	IEEE (Institute of Electrical and Electronics Engineers)
Publikationsdato	4 sep. 2023
Artikelnummer	10264265
ISBN (Trykt)	979-8-3503-1678-0
ISBN (Elektronisk)	978-9-0758-1541-2
DOI	https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264265
Status	Udgivet - 4 sep. 2023
Begivenhed	2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) - Aalborg, Danmark Varighed: 4 sep. 2023 → 8 sep. 2023

Konference

Konference	2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)
Land/Område	Danmark
By	Aalborg
Periode	04/09/2023 → 08/09/2023

Adgang til dokumentet

10.23919/EPE23ECCEEurope58414.2023.10264265

Thermal_cycling_characterization_of_integrated_GaN_power_moduleAccepteret manuskript, 4,24 MB

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Link to publication in Scopus

Digital Twin-based and Machine Learning-assisted GaN Power Module Packaging Reliability Analysis Method
Sun, Z. (PI (principal investigator)), Munk-Nielsen, S. (Supervisor), Uhrenfeldt, C. (Supervisor) & Jørgensen, A. B. (Supervisor)
01/12/2021 → 31/05/2025
Projekter: Projekt › Ph.d.-projekt
CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S. (PI (principal investigator)), Jørgensen, A. B. (CoPI), Uhrenfeldt, C. (CoPI), Beczkowski, S. M. (Projektdeltager), Ahmad, F. (Projektdeltager), Meinert, J. D. (Projektdeltager), Kubulus, P. P. (Projektdeltager), Takahashi, M. (Projektdeltager), Sun, Z. (Projektdeltager), Wang, R. (Projektdeltager), Gao, Y. (Projektdeltager), Zäch, M. R. (Projektdeltager), Meyer, S. (Projektdeltager), Liccardi, S. (Projektdeltager), Kristensen, N. H. (Projektdeltager) & Steffensen, B. (Projektkoordinator)
Poul Due Jensens Fond
01/01/2021 → 31/12/2026
Projekter: Projekt › Forskning

Citationsformater

@inproceedings{16b48a5fd7454e2bb75bdc3fa66c9775,

title = "Thermal cycling characterization of integrated GaN power module",

abstract = "A thermal cycling test is developed on a low parasitic inductance integrated GaN power module by monitoring the electrical and thermal parameters. The failure points of DBC and solder attach leading to increased thermal resistance are located, and the failure mechanism is analyzed based on Scanning Acoustic Microscope observation.",

keywords = "Degradation, Failure modes, Gallium Nitride (GaN), Packaging, Thermal cycling",

author = "Zhongchao Sun and Masaki Takahashi and Stig Munk-Nielsen and J{\o}rgensen, {Asger Bj{\o}rn}",

year = "2023",

month = sep,

day = "4",

doi = "10.23919/EPE23ECCEEurope58414.2023.10264265",

language = "English",

isbn = "979-8-3503-1678-0",

booktitle = "2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe",

publisher = "IEEE (Institute of Electrical and Electronics Engineers)",

address = "United States",

note = "2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) ; Conference date: 04-09-2023 Through 08-09-2023",

}

Sun, Z , Takahashi, M , Munk-Nielsen, S & Jørgensen, AB 2023, Thermal cycling characterization of integrated GaN power module. i 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe., 10264265, IEEE (Institute of Electrical and Electronics Engineers), 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe), Aalborg, Danmark, 04/09/2023. https://doi.org/10.23919/EPE23ECCEEurope58414.2023.10264265

Thermal cycling characterization of integrated GaN power module. / Sun, Zhongchao ; Takahashi, Masaki ; Munk-Nielsen, Stig et al.
2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. IEEE (Institute of Electrical and Electronics Engineers), 2023. 10264265.

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

TY - GEN

T1 - Thermal cycling characterization of integrated GaN power module

AU - Sun, Zhongchao

AU - Takahashi, Masaki

AU - Munk-Nielsen, Stig

AU - Jørgensen, Asger Bjørn

PY - 2023/9/4

Y1 - 2023/9/4

N2 - A thermal cycling test is developed on a low parasitic inductance integrated GaN power module by monitoring the electrical and thermal parameters. The failure points of DBC and solder attach leading to increased thermal resistance are located, and the failure mechanism is analyzed based on Scanning Acoustic Microscope observation.

AB - A thermal cycling test is developed on a low parasitic inductance integrated GaN power module by monitoring the electrical and thermal parameters. The failure points of DBC and solder attach leading to increased thermal resistance are located, and the failure mechanism is analyzed based on Scanning Acoustic Microscope observation.

KW - Degradation

KW - Failure modes

KW - Gallium Nitride (GaN)

KW - Packaging

KW - Thermal cycling

UR - http://www.scopus.com/inward/record.url?scp=85175145235&partnerID=8YFLogxK

U2 - 10.23919/EPE23ECCEEurope58414.2023.10264265

DO - 10.23919/EPE23ECCEEurope58414.2023.10264265

M3 - Article in proceeding

SN - 979-8-3503-1678-0

BT - 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe

PB - IEEE (Institute of Electrical and Electronics Engineers)

T2 - 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)

Y2 - 4 September 2023 through 8 September 2023

ER -

Thermal cycling characterization of integrated GaN power module

Abstract

Konference

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Fingeraftryk

Projekter

Digital Twin-based and Machine Learning-assisted GaN Power Module Packaging Reliability Analysis Method

CoDE: Center of Digitalized Electronics (CoDE)

Citationsformater