Thermal Mapping of Power Modules Using Optical Fibers during AC Power Cycling Tests

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Abstract

The power cycling withstand capability of power semiconductors is of great interest in determining the component's qualification and reliability performance. Compared to the traditional DC Power cycling test, the AC power cycling test can accelerate the component to fail under more realistic operating conditions. The wear process in the AC power cycling test depends on many parameters, among which the maximum junction temperature TJ, and temperature swing ΔTj are crucial to be determined. The traditional way in DC power cycling test is to measure the Tj indirectly using the temperature-sensitive electrical parameter (TSEP) method, which is not very applicable during the AC power cycling test as it will increase the circuit complicity and may interrupt the PWM operation. The purpose of this paper is to evaluate a direct junction temperature measurement in an IGBT power module through silicone gel using optical fibers, which enables a fast and accurate Tj determination during AC power cycling. For this purpose, junction temperatures have been measured for both gel-filled modules and gel-removed modules under different experimental conditions. The experimental results presented concern about: the presence of silicone gel's impact on the TJ measurement accuracy, the temperature difference inside the silicone gel while the optical fiber is being instrumented at different positions, and the spatial temperature distributions of the IGBT chip. Future work will also include the comparison of the TJ measurements of a gel-filled power module between using the optical fibers and the well-established TSEP method.

OriginalsprogEngelsk
TitelAPEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition
Antal sider4
ForlagIEEE
Publikationsdato2023
Sider2630-2633
Artikelnummer10131209
ISBN (Elektronisk)9781665475396
DOI
StatusUdgivet - 2023
Begivenhed38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023 - Orlando, USA
Varighed: 19 mar. 202323 mar. 2023

Konference

Konference38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023
Land/OmrådeUSA
ByOrlando
Periode19/03/202323/03/2023
SponsorIEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)
NavnI E E E Applied Power Electronics Conference and Exposition. Conference Proceedings
ISSN1048-2334

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