Thermal Modeling and Design Optimization of PCB Vias and Pads

Yanfeng Shen, Huai Wang, Frede Blaabjerg, Hui Zhao, Teng Long

Publikation: Bidrag til tidsskriftTidsskriftartikelForskningpeer review

50 Citationer (Scopus)
1629 Downloads (Pure)

Fingeraftryk

Dyk ned i forskningsemnerne om 'Thermal Modeling and Design Optimization of PCB Vias and Pads'. Sammen danner de et unikt fingeraftryk.

Material Science

Chemical Engineering

Engineering