Thermal Modeling Method Considering Ambient Temperature Dynamics

Haoran Wang, Rongwu Zhu, Huai Wang, Marco Liserre, Frede Blaabjerg

Publikation: Bidrag til tidsskriftLetterForskningpeer review

Resumé

This letter proposes a thermal modeling method for power electronic components. It represents the thermal dynamics introduced by the ambient temperature variation, which can not be achieved by existing methods. By using the superposition theorem and time-domain analysis, the limitations of the existing method based on stable ambient temperature is investigated in this letter. Then the proposed thermal modeling method, which considers the thermal dynamics from both power loss and ambient temperature disturbances, is presented. In order to obtain the thermal coefficients in the proposed model, two solutions are provided based on frequency-domain modeling. Experimental verification is given to proof the accuracy of the proposed thermal modeling method considering the ambient temperature dynamics.
OriginalsprogEngelsk
TidsskriftI E E E Transactions on Power Electronics
ISSN0885-8993
DOI
StatusE-pub ahead of print - jun. 2019

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Temperature
Time domain analysis
Power electronics
Hot Temperature

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@article{97053d015fa44136af46914d06749824,
title = "Thermal Modeling Method Considering Ambient Temperature Dynamics",
abstract = "This letter proposes a thermal modeling method for power electronic components. It represents the thermal dynamics introduced by the ambient temperature variation, which can not be achieved by existing methods. By using the superposition theorem and time-domain analysis, the limitations of the existing method based on stable ambient temperature is investigated in this letter. Then the proposed thermal modeling method, which considers the thermal dynamics from both power loss and ambient temperature disturbances, is presented. In order to obtain the thermal coefficients in the proposed model, two solutions are provided based on frequency-domain modeling. Experimental verification is given to proof the accuracy of the proposed thermal modeling method considering the ambient temperature dynamics.",
author = "Haoran Wang and Rongwu Zhu and Huai Wang and Marco Liserre and Frede Blaabjerg",
year = "2019",
month = "6",
doi = "10.1109/TPEL.2019.2924723",
language = "English",
journal = "I E E E Transactions on Power Electronics",
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Thermal Modeling Method Considering Ambient Temperature Dynamics. / Wang, Haoran; Zhu, Rongwu; Wang, Huai; Liserre, Marco; Blaabjerg, Frede.

I: I E E E Transactions on Power Electronics, 06.2019.

Publikation: Bidrag til tidsskriftLetterForskningpeer review

TY - JOUR

T1 - Thermal Modeling Method Considering Ambient Temperature Dynamics

AU - Wang, Haoran

AU - Zhu, Rongwu

AU - Wang, Huai

AU - Liserre, Marco

AU - Blaabjerg, Frede

PY - 2019/6

Y1 - 2019/6

N2 - This letter proposes a thermal modeling method for power electronic components. It represents the thermal dynamics introduced by the ambient temperature variation, which can not be achieved by existing methods. By using the superposition theorem and time-domain analysis, the limitations of the existing method based on stable ambient temperature is investigated in this letter. Then the proposed thermal modeling method, which considers the thermal dynamics from both power loss and ambient temperature disturbances, is presented. In order to obtain the thermal coefficients in the proposed model, two solutions are provided based on frequency-domain modeling. Experimental verification is given to proof the accuracy of the proposed thermal modeling method considering the ambient temperature dynamics.

AB - This letter proposes a thermal modeling method for power electronic components. It represents the thermal dynamics introduced by the ambient temperature variation, which can not be achieved by existing methods. By using the superposition theorem and time-domain analysis, the limitations of the existing method based on stable ambient temperature is investigated in this letter. Then the proposed thermal modeling method, which considers the thermal dynamics from both power loss and ambient temperature disturbances, is presented. In order to obtain the thermal coefficients in the proposed model, two solutions are provided based on frequency-domain modeling. Experimental verification is given to proof the accuracy of the proposed thermal modeling method considering the ambient temperature dynamics.

U2 - 10.1109/TPEL.2019.2924723

DO - 10.1109/TPEL.2019.2924723

M3 - Letter

JO - I E E E Transactions on Power Electronics

JF - I E E E Transactions on Power Electronics

SN - 0885-8993

ER -