Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

Faheem Ahmad; Thore Stig Aunsborg; Szymon Beczkowski; Stig Munk-Nielsen; Asger Bjørn Jørgensen

Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

Faheem Ahmad, Thore Stig Aunsborg, Szymon Beczkowski, Stig Munk-Nielsen, Asger Bjørn Jørgensen

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

282 Downloads (Pure)

Abstract

Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.

Originalsprog	Engelsk
Titel	Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
Antal sider	6
Udgivelsessted	Berlin, Germany
Forlag	VDE Verlag GMBH
Publikationsdato	19 aug. 2022
ISBN (Trykt)	978-3-8007-5757-2
Status	Udgivet - 19 aug. 2022
Begivenhed	CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems - Berlin, Tyskland Varighed: 15 mar. 2022 → 17 mar. 2022

Konference

Konference	CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems
Land/Område	Tyskland
By	Berlin
Periode	15/03/2022 → 17/03/2022

Adgang til dokumentet

CIPS_2022_Paper_with_postprintAccepteret manuskript, 4,08 MB

https://ieeexplore.ieee.org/document/9862001

AUB Link

Søg efter materialet i Aalborg Universitetsbiblioteks søgemaskine

1 Igangværende
2 Afsluttet

CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S., Jørgensen, A. B., Uhrenfeldt, C., Beczkowski, S. M., Ahmad, F., Meinert, J. D., Kubulus, P. P., Takahashi, M., Sun, Z., Wang, R., Gao, Y., Zäch, M. R., Meyer, S. & Steffensen, B.
Poul Due Jensens Fond
01/01/2021 → 31/12/2025
Projekter: Projekt › Forskning
Transistorization of Industrial Dielectric Heating Plants
Ahmad, F., Munk-Nielsen, S. & Jørgensen, A. B.
01/01/2021 → 31/12/2023
Projekter: Projekt › Ph.d.-projekt
RFheat: Radio Frequency Curing Technology
Munk-Nielsen, S., Uhrenfeldt, C., Jørgensen, A. B., Ahmad, F. & Steffensen, B.
Innovationsfonden
01/09/2020 → 31/08/2021
Projekter: Projekt › Forskning

1 Ph.d.-afhandling

Transistorization of Industrial Dielectric Heating Plants
Ahmad, F., 2023, Aalborg Universitetsforlag. 179 s.
Publikation: Ph.d.-afhandling

Åben adgang
Fil

50 Downloads (Pure)

Citationsformater

@inproceedings{cbf47353be074031b33d689ac2b54ad5,

title = "Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices",

abstract = "Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.",

keywords = "GaN device, Digital Twin, Thermal Analysis, Packaging technology",

author = "Faheem Ahmad and Aunsborg, {Thore Stig} and Szymon Beczkowski and Stig Munk-Nielsen and J{\o}rgensen, {Asger Bj{\o}rn}",

year = "2022",

month = aug,

day = "19",

language = "English",

isbn = "978-3-8007-5757-2",

booktitle = "Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems",

publisher = "VDE Verlag GMBH",

note = "CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, CIPS 2022 ; Conference date: 15-03-2022 Through 17-03-2022",

}

Ahmad, F , Aunsborg, TS , Beczkowski, S , Munk-Nielsen, S & Jørgensen, AB 2022, Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices. i Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. VDE Verlag GMBH, Berlin, Germany, CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, Tyskland, 15/03/2022. <https://ieeexplore.ieee.org/document/9862001>

Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices. / Ahmad, Faheem ; Aunsborg, Thore Stig ; Beczkowski, Szymon et al.
Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems. Berlin, Germany: VDE Verlag GMBH, 2022.

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

TY - GEN

T1 - Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

AU - Ahmad, Faheem

AU - Aunsborg, Thore Stig

AU - Beczkowski, Szymon

AU - Munk-Nielsen, Stig

AU - Jørgensen, Asger Bjørn

PY - 2022/8/19

Y1 - 2022/8/19

N2 - Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.

AB - Utilizing the fast switching speed of gallium nitride (GaN) devices requires compact and low inductive printed circuit board (PCB) layouts. A heatsink is mounted to operate the GaN devices at high power. However, auxiliary components such as DC-link capacitors or gate drivers must be moved out of proximity or to the other side of the PCB to fit the heatsink. This paper analyses an integrated heat spreader solution which provides flexibility in designing an optimized electrical layout as well as providing thermal performance that is comparable to conventional thermal-pad with a flat heatsink cooling method.

KW - GaN device

KW - Digital Twin

KW - Thermal Analysis

KW - Packaging technology

M3 - Article in proceeding

SN - 978-3-8007-5757-2

BT - Proceedings of CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems

PB - VDE Verlag GMBH

CY - Berlin, Germany

T2 - CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems

Y2 - 15 March 2022 through 17 March 2022

ER -

Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices

Abstract

Konference

Adgang til dokumentet

AUB Link

Fingeraftryk

Projekter

CoDE: Center of Digitalized Electronics (CoDE)

Transistorization of Industrial Dielectric Heating Plants

RFheat: Radio Frequency Curing Technology

Publikation

Transistorization of Industrial Dielectric Heating Plants

Citationsformater