Thermal Stress Model of Transversal Forced Air-Cooled Capacitor Banks for MW Power Converters

Z. Yin, Rui Wu, Morten Hygum, Y. Yang, H. Wang

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

OriginalsprogEngelsk
Titel2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)
Antal sider6
ForlagIEEE Press
Publikationsdatomaj 2019
Sider3096-3101
ISBN (Trykt)978-1-7281-1612-9
ISBN (Elektronisk)978-89-5708-313-0
StatusUdgivet - maj 2019
Begivenhed10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Sydkorea
Varighed: 27 maj 201930 maj 2019

Konference

Konference10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
LandSydkorea
ByBusan
Periode27/05/201930/05/2019
NavnInternational Conference on Power Electronics
ISSN2150-6078

Citationsformater

Yin, Z., Wu, R., Hygum, M., Yang, Y., & Wang, H. (2019). Thermal Stress Model of Transversal Forced Air-Cooled Capacitor Banks for MW Power Converters. I 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia) (s. 3096-3101). IEEE Press. International Conference on Power Electronics https://ieeexplore.ieee.org/abstract/document/8796881