Thermo-mechanical Characterisation of In-plane Properties for CSM E-glass Epoxy Polymer Composite Materials: Part 2: Young's Modulus

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Abstract

The in-plane Young’s modulus of a CSM E-glass/epoxy material is characterised through
the use of dynamic mechanical analysis (DMA). The measured data is used to generate
material models which describe the property behaviour as a function of conversion and
temperature. Gelation of the epoxy resin plays a major role in the modulus development
and is measured directly on the glass/epoxy material. The Young’s modulus is described
through a bi-functional model including the liquid/solid transition of the material. The
evolution of Young’s modulus is modelled by decoupling modulus increments caused by
time and temperature, and is graphically illustrated through a Modulus-Temperature-
Transformation (MTT) diagram. Based on the established material models presented in
this paper and models in Part-1, it is feasible to assess residual stresses and shape distortions
of composite parts made from this glass/epoxy material.
OriginalsprogEngelsk
TidsskriftPolymer Testing
Vol/bind32
Udgave nummer8
Sider (fra-til)1417-1422
ISSN0142-9418
DOI
StatusUdgivet - 2013

Emneord

  • Composite, Thermal analysis, Material models, Curing

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