Transient Voltage Stress Modeling for Submodules of Modular Multilevel Converters under Grid Voltage Sags

Zhijian Yin, Yongheng Yang, Huai Wang

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2 Citationer (Scopus)

Abstrakt

The trend for the model-based design of modular multilevel converters (MMC) demands a better estimation of the submodule (SM) voltage stress. The transient voltage stresses of MMC SMs are important for the SM capacitor dimensioning and the robustness of power modules. This paper proposes an analytical model of the SM transient voltage stress under grid voltage sags. It is based on a simplified analysis of the MMC current control and circulating current control schemes. A case study reveals that a sufficient accuracy level can be achieved with the proposed model to estimate the transient voltage stress.
OriginalsprogEngelsk
TitelProceedings of the 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
Antal sider6
ForlagIEEE Press
Publikationsdatomaj 2018
Sider1021-1026
Artikelnummer8507962
ISBN (Trykt)978-1-5386-4190-3
ISBN (Elektronisk)978-4-88686-405-5
DOI
StatusUdgivet - maj 2018
Begivenhed8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, Japan
Varighed: 20 maj 201824 maj 2018

Konference

Konference8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
LandJapan
ByNiigata
Periode20/05/201824/05/2018
SponsorIEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), IEEJ Industry Applications Society (IAS)

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