Wear-out evolution analysis of multiple-bond-wires power modules based on thermo-electro-mechanical FEM simulation

Maogong Jiang, Guicui Fu*, Martin Bendix Fogsgaard, Amir Sajjad Bahman, Yongheng Yang, Francesco Iannuzzo

*Kontaktforfatter

Publikation: Bidrag til tidsskriftTidsskriftartikel

Abstrakt

In this paper, an electro-thermo-mechanical finite-element method (FEM) simulation approach is proposed to analyse the wear-out evolution of multiple-bond-wires chips in power electronic modules. Cracks are introduced along the simulation, based on the sensitive damage position at each simulation step, in order to emulate the realistic wear-out sequence occurring in real cases. This process has been made semi-automatically, by running many simulations, each time with updated crack geometry using the previous step results. The proposed method has been successfully used to interpret the typical on-state voltage degradation curve of accelerated life tests.
OriginalsprogEngelsk
Artikelnummer113472
TidsskriftMicroelectronics Reliability
Vol/bind100-101
Antal sider6
ISSN0026-2714
DOI
StatusUdgivet - sep. 2019

    Fingerprint

Citationsformater