the International Power Electronics Conference, IPEC-Niigata 2018 -ECCE Asia

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• Impact of the Thermal-Interface-Material Thickness on IGBT Module Reliability in the Modular Multilevel Converter

  Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

• Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters

  Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review