Power Cycling of a Latest Standard “New Dual” IGBT Module for High Power Applications

Description

Benefiting from a complete thermal characterization to ensure consistency between the digital model and the final device

Power electronics are being adopted at a rapid pace across various market segments, with more demand for miniaturised and integrated complex solutions, but with these market pressures, how can such power devices remain reliable and provide adequate performance. Despite the vast knowledge applied during the design phase, the market is showing its limitation in terms of testing standards and know-how, in particular when Wide Band Gap devices are the subject.

During this webinar, Dr. Yi Zhang from Aalborg University will show how they’ve used Siemens’ Simcenter technology to gather valuable thermal insights in favour of their extensive research in the power electronics field while supporting industry clients in the adoption of new technologies. Antonio Caruso from Siemens will provide an overview of how the latest Simcenter technology help bridge the gap between the design phase and production.