Projects per year
Fingerprint
Collaborations from the last five years
Profiles
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Faheem Ahmad
- The Faculty of Engineering and Science - Post.Doc.
- AAU Energy - Post.Doc.
- Electric Power Systems and Microgrids - Post.Doc.
- Power Electronics System Integration and Materials - Post.Doc.
- Electronic Power Grid
- Power Electronics Packaging, Materials and Emerging Applications
Person: VIP
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Thore Stig Aunsborg
- The Faculty of Engineering and Science - Post.Doc.
- AAU Energy - Post.Doc.
- Electric Power Systems and Microgrids - Post.Doc.
- Power Electronics System Integration and Materials - Post.Doc.
- Electronic Power Grid
- Power Electronics Packaging, Materials and Emerging Applications
Person: VIP
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Szymon Michal Beczkowski
- The Faculty of Engineering and Science - Associate Professor
- AAU Energy - Associate Professor
- Power Electronics System Integration and Materials - Associate Professor
- Electronic Power Grid
- Power Electronics Packaging, Materials and Emerging Applications
Person: VIP
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Development of Grid Supporting Functionalities for Fast Charging Stations
Ibrahim, A., Wang, X., Wu, H. & De Falco, G.
01/11/2023 → 31/10/2026
Project: PhD Project
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Universal Fast Charger with Wide Output Voltage
Cinik, S., Wang, X. & Zhao, F.
01/08/2023 → 31/07/2026
Project: PhD Project
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Development of Methodology for Small-Signal Stability Assessment in Energy Island Type Systems
Bollerslev, J., Wang, X., Kwon, J., Wu, H. & Liao, Y.
01/06/2023 → 31/05/2026
Project: PhD Project
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A Computational Multiscale Modeling Method for Nanosilver-Sintered Joints with Stochastically Distributed Voids
Sun, Z., Guo, W. & Jørgensen, A. B., 8 Mar 2024, In: Journal of Electronic Materials. 18 p.Research output: Contribution to journal › Journal article › Research › peer-review
Open Access -
Adaptive Harmonic Conductance Control for Boost PFC Converters at Light Loads
Zhu, T., Zhao, F., Wang, X. & Torrico-Bascope, G. V., 1 Mar 2024, In: IEEE Transactions on Power Electronics . 39, 3, p. 3175-3185 11 p., 10372115.Research output: Contribution to journal › Journal article › Research › peer-review
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Analysis of the Influence of the Bottom-layer Copper in Direct-Bond Copper Substrate on its Overall Electric Field and Partial Discharge Performance
Gao, Y., Aunsborg, T. S., Yin, K., Bak, C. L., Zhao, H., zhang, Z., Munk-Nielsen, S. & Uhrenfeldt, C., 2024, (Submitted) In: I E E E Power Electronics Letters. 4 p.Research output: Contribution to journal › Letter › peer-review
File
Prizes
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APEC 2023 Outstanding poster award
Takahashi, Masaki (Recipient), Jørgensen, Jannick Kjær (Recipient), Jørgensen, Asger Bjørn (Recipient), Munk-Nielsen, Stig (Recipient) & Uhrenfeldt, Christian (Recipient), 23 Mar 2023
Prize: Conference prizes
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2020 Star Reviewer of IEEE Journal of Emerging and Selected Topics in Power Electronics
Liao, Yicheng (Recipient), May 2021
Prize: Other prizes
Activities
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Introduction to ANSYS Q3D Extractor
Asger Bjørn Jørgensen (Lecturer)
23 Nov 2023Activity: Talks and presentations › Talks and presentations in private or public companies
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PDJF Grundfos Prize 2023 "The Stars of Tomorrow" EXPO
Asger Bjørn Jørgensen (Participant), Faheem Ahmad (Participant), Pawel Piotr Kubulus (Participant) & Janus Dybdahl Meinert (Participant)
9 Nov 2023Activity: Attending an event › Organisation or participation in workshops, courses, seminars, exhibitions or similar
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ECPE Joint Stand at PCIM Europe 2023
Masaki Takahashi (Participant) & Jannick Kjær Jørgensen (Participant)
9 May 2023 → 11 May 2023Activity: Attending an event › Conference organisation or participation
Press/Media
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Den Lyse Idé prisen til unge forskere
09/11/2023 → 15/11/2023
3 items of Media coverage
Press/Media: Press / Media
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Kommentar: Nye mikrochips forbedrer din hverdag og styrker den grønne omstilling
30/12/2022
1 Media contribution
Press/Media: Press / Media