Projects per year
Fingerprint
The fingerprint consists of automatically generated concepts related to the associated persons. It is updated automatically, when new content is added.
- 3 Similar Profiles
Network
Dive into details by clicking on the dots.
Projects
- 1 Active
-
APETT: Advanced Power Electronic Technology and Tools
Blaabjerg, F., Munk-Nielsen, S., Iannuzzo, F., Wang, H., Uhrenfeldt, C., Beczkowski, S. M., Zhou, D., Choi, U., Jørgensen, A. B., Vernica, I., Sangwongwanich, A., Christensen, N., Ceccarelli, L., Nielsen, C. K., Bahman, A. S., Pedersen, K., Pedersen, K. B. & Kristensen, P. K.
01/01/2017 → 30/06/2021
Project: Research
Research Output
-
Fourier transform second harmonic generation for high-resolution nonlinear spectroscopy
Kristensen, M. H., Kristensen, P. K., Pedersen, K. & Skovsen, E., 1 Mar 2021, In : Optics Communications. 482, 126593.Research output: Contribution to journal › Journal article › Research › peer-review
-
Phenol Abatement by Titanium Dioxide Photocatalysts: Effect of The Graphene Oxide Loading
Naknikham, U., Magnacca, G., Qiao, A., Kristensen, P. K., Boffa, V. & Yue, Y., Jun 2019, In : Nanomaterials. 9, 7, 11 p., 947.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile3 Citations (Scopus)25 Downloads (Pure) -
Proof-of-concept for a kelvin-emitter on-chip temperature sensor for power semiconductors
Baker, N., Iannuzzo, F., Beczkowski, S. & Kristensen, P. K., Sep 2019, Proceedings of 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). IEEE Signal Processing Society, 8 p. 8914963Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review
-
Comparative study of Al metallization degradation in power diodes under passive and active thermal cycling
Brincker, M., Pedersen, K. B., Kristensen, P. K. & Popok, V., 26 Oct 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 12, p. 2073-2080 8 p., 8506441.Research output: Contribution to journal › Journal article › Research › peer-review
Open AccessFile2 Citations (Scopus)206 Downloads (Pure) -
Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates
Brincker, M., Kristensen, P. K., Söhl, S., Eisele, R. & Popok, V. N., 1 Sep 2018, In : Microelectronics Reliability. 88-90, September 2018, p. 774-778 5 p.Research output: Contribution to journal › Conference article in Journal › Research › peer-review