• Fredrik Bajers Vej 7, C1-107

    9220 Aalborg Ø

    Denmark

20022024

Research activity per year

Network

Kazunori Hayashi

  • Kyoto University

External person

Bho Matthiesen

  • University of Bremen, Department of Communications Engineering
  • University of Bremen

External person

Hideaki Sakai

  • Kyoto University

External person

Taufik Abrão

  • Londrina State University, Parana, Brazil
  • Universidade Estadual de Londrina

External person

Kaibin Huang

  • The University of Hong Kong

External person

Emil Bjornson

  • Linköping University
  • KTH Royal Institute of Technology

External person

Osvaldo Simeone

  • New Jersey Institute of Technology

External person

Mehdi Bennis

  • University of Oulu
  • Kyung Hee University

External person

Megumi Kaneko

  • Kyoto University

External person

Erik G. Larsson

  • Linköping University
  • Uppsala University

External person

Young-Kwon Cho

  • Samsung Electronics CO., LTD
  • Samsung

External person

Armin Dekorsy

  • University of Bremen

External person

Walid Saad

  • Department of Electrical and Computer Engineering, Virginia Tech
  • Virginia Polytechnic Institute and State University
  • Kyung Hee University

External person

Nikola Zlatanov

  • Monash University

External person

Henk Wymeersch

  • Chalmers University of Technology

External person

Federico Boccardi

  • Vodafone
  • Ofcom
  • Ofcom

External person

Zoran Utkovski

  • Ulm University

External person

Qiao Lan

  • The University of Hong Kong

External person

Constantinos Papadias

  • Athens Information Technology
  • American College of Greece

External person

Pedro Henrique Juliano Nardelli

  • Lappeenranta-Lahti University of Technology

External person

Wanchun Liu

  • Australian National University

External person

Hiroyuki Yomo

  • Kansai University

External person

Pedro H. J. Nardelli

  • Lappeenranta-Lahti University of Technology

External person

Armin Dekorsy

  • University of Bremen, Department of Communications Engineering

External person

Anna Scaglione

  • Arizona State University

External person

Carlo Fischione

  • KTH Royal Institute of Technology

External person

Deniz Gündüz

  • Imperial College London

External person

Jasper Goseling

  • University of Twente

External person

Giuseppe Durisi

  • Chalmers University of Technology

External person

Michele Zorzi

  • University of Padua

External person

Meixia Tao

  • Department of Electronic Engineering, Shanghai Jiao Tong University

External person

Marios Kountouris

  • Huawei Technologies Co., Ltd.

External person

Gabor Fodor

  • Ericsson AB
  • KTH Royal Institute of Technology

External person

Andrea Zanella

  • University of Padua

External person

Arthur S. de Sena

  • Lappeenranta-Lahti University of Technology

External person

Hossein Shokri-Ghadikolaei

  • KTH Royal Institute of Technology

External person

Vahid Tarokh

  • Harvard University

External person

Yuping Zhao

  • State Key Laboratory of Advanced Optical Communication Systems and Networks, Peking University
  • Peking University

External person

Christina Chaccour

  • Department of Electrical and Computer Engineering, Virginia Tech

External person

Maik Röper

  • University of Bremen, Department of Communications Engineering

External person

Wei Yang

  • Princeton University

External person

Toshiaki Koike-Akino

  • Harvard University

External person

George C. Alexandropoulos

  • National and Kapodistrian University of Athens

External person

Alexandre Graell i Amat

  • Chalmers University of Technology

External person

Arthur S. de Sena

  • Lappeenranta-Lahti University of Technology

External person

Elza Erkip

  • New York University Tandon School of Engineering, Brooklyn
  • New York University

External person

Xiangyun Zhou

  • Research School of Engineering, Australian National University
  • Australian National University

External person

Hongpeng Liu

  • Harbin Institute of Technology
  • Northeast Electrical Power University

External person

Zoran Utkovski

  • Goce Delicev University of Stip
  • Universidad Carlos III de Madrid
  • Macedonian Academy of Sciences and Arts

External person

Gang Wang

  • Harbin Institute of Technology
  • Tianjin University of Technology

External person

Marcos Katz

  • Samsung Electronics

External person

Nikolaj Marchenko

  • Robert Bosch GmbH

External person

Danijela Cabric

  • University of California
  • University of California at Los Angeles

External person

Umberto Spagnolini

  • Polytechnic University of Milan

External person

Dirk Wübben

  • University of Bremen, Department of Communications Engineering

External person

Vincenzo Sciancalepore

  • NEC Laboratories Europe

External person

Behrouz Maham

  • University of Tehran
  • Nazarbayev University

External person

Mohsen Mohammadkhani Razlighi

  • Department of Electrical and Computer Systems Engineering, Monash University

External person

Dong-Seek Park

  • Samsung Electronics CO., LTD

External person

Branka Vucetic

  • University of Sydney

External person

Dejan Vukobratovic

  • University of Novi Sad

External person

Arne Bröring

  • University of Münster
  • Siemens

External person

Mikhail Ivanov

  • Chalmers University of Technology

External person

José Carlos Marinello

  • Londrina State University, Parana, Brazil
  • Universidade Tecnológica Federal do Paraná

External person

Ghaith Hattab

  • Apple Inc.
  • University of California at Los Angeles
  • Apple

External person

Eun-Taek Lim

  • Samsung Electronics CO., LTD

External person

Salman Durrani

  • Australian National University

External person

David Gregoratti

  • Catalan Telecommunications Technology Centre

External person

Giuseppe Durisi

  • Chalmers University of Technology

External person

Bruno Clerckx

  • Imperial College London

External person

Daniella Costa

  • University of Aveiro

External person

Yijie Mao

  • Imperial College London

External person

H. Vincent Poor

  • Princeton University

External person

Qunsong Zeng

  • The University of Hong Kong

External person

Gabriele Gradoni

  • University of Nottingham

External person

Marco Moretti

  • University of Pisa
  • National Inter-University Consortium for Telecommunications
  • University of Siena

External person

Carsten Bockelmann

  • University of Bremen, Department of Communications Engineering

External person

Daniel B. da Costa

  • Technology Innovation Institute (TII)
  • National Yunlin University of Science and Technology

External person

Jung-Min Ro

  • Samsung Electronics CO., LTD

External person

Zhiguo Ding

  • University of Manchester

External person

Victor Croisfelt Rodrigues

  • Universidade de São Paulo

External person

Theodoros A. Tsiftsis

  • Jinan University

External person

Dong-Seek Park

  • Samsung Electronics

External person

Petar Solic

  • University of Split

External person

Malcolm Egan

  • Université de Lyon

External person

Guowang Miao

  • KTH Royal Institute of Technology

External person

Hitoshi Kawakita

  • Kansai University

External person

A. M. Fouladgar

  • New Jersey Institute of Technology

External person

Sumudu Samarakoon

  • University of Oulu

External person

Roberto Pereira

  • Catalan Telecommunications Technology Centre

External person

Giuseppe Durisi

  • Chalmers University of Technology

External person

Liang Liu

  • National University of Singapore
  • Lund University
  • Hong Kong Polytechnic University

External person

Onur Sahin

  • InterDigital Europe, Ltd.

External person

Marco Levorato

  • Stanford University

External person

Yong-Ho Park

  • Samsung Electronics

External person

Sung-Kwon Hong

  • Samsung Electronics

External person

O. Simeone

  • New Jersey Institute of Technology

External person

Gerhard Wunder

  • Fraunhofer Heinrich Hertz Institut Berlin
  • Free University of Berlin

External person

Sundeep Rangan

  • New York University Polytechnic Institute

External person

Robert W. Heath

  • Wireless Networking and Communications Group, University of Texas

External person

Eva Lagunas

  • University of Luxembourg

External person

Luca Sanguinetti

  • Dipartimento di Ingegneria dell’Informazione, University of Pisa
  • University of Pisa

External person

Erik G. Larsson

  • Linköping University

External person

Panyuh Joo

  • Samsung Electronics

External person

Thomas L. Marzetta

  • Bell Labs, Alcatel-Lucent

External person

Yonghui Li

  • The University of Sydney
  • CAS - Institute of Psychology
  • University of Chinese Academy of Sciences

External person

Yalei Ji

  • University of Bremen, Department of Communications Engineering

External person

Siddharth Chandak

  • Department of Electrical Engineering IIT Bombay

External person

Erik G. Strom

  • Chalmers University of Technology

External person

Mehdi Naderi Soorki

  • Shahid Chamran University of Ahvaz

External person

Miaowen Wen

  • South China University of Technology

External person

Xavier Mestre

  • Catalan Telecommunications Technology Centre

External person

Robert W. Heath Jr.

  • University of Texas at Austin

External person

Wonju Lee

  • Korea Advanced Institute of Science and Technology

External person

Carsten Bockelmann

  • University of Bremen

External person

Xiangyun Zhou

  • Australian National University

External person

Shinsuke Hara

  • Osaka City University

External person

Cicek Cavdar

  • KTH Royal Institute of Technology

External person

Khac-Hoang Ngo

  • Chalmers University of Technology

External person

Chuyen T. Nguyen

  • Kyoto Univerity

External person

Z. Utkovski

  • University Goce Delcev Stip
  • University Goce Delcev

External person

Mattia Rebato

  • University of Padova, Padova, Italy.

External person

Octavia A. Dobre

  • Memorial University of Newfoundland

External person

Enes Krijestorac

  • Electrical and Computer Engineering Department, University of California
  • University of California at Los Angeles

External person

Youngbin Chang

  • Samsung Electronics

External person

Gianluigi Liva

  • German Aerospace Center

External person

Anay Ajit Deshpande

  • University of Padua
  • Department of Information Engineering

External person

Francisco Lazaro

  • German Aerospace Center

External person

Gui Zhou

  • Friedrich-Alexander University Erlangen-Nürnberg

External person

Giuseppe Durisi

  • Chalmers University of Technology

External person

Cunhua Pan

  • Southeast University, Nanjing

External person

Chiara Pielli

  • University of Padua

External person

Osvaldo Simeone

  • CWCSPR, New Jersey Institute of Technology, NJ, USA

External person

Rahif Kassab

  • Centre for Telecommunications Research, King’s College London

External person

Alexandre Graelli Amat

  • Chalmers University of Technology

External person

Changyoon Oh

  • Samsung Electronics

External person

Junya Shiraishi

  • Kansai University

External person

Toshiaki Koike-Akino

  • Mitsubishi Materials Corporation

External person

Hong Ren

  • Southeast University, Nanjing

External person

Osvaldo Simeone

  • New Jersey Institute of Technology

External person

Michele Zorzi

  • Padova University

External person

Rafael M. Lima

  • University of Ceara

External person

Cheng Shan

  • Samsung Electronics

External person

Eun-Taek Lim

  • Samsung Electronics

External person

Luis G. Ordonez

  • Huawei Technologies Co., Ltd.

External person

Jacob Chakareski

  • Ecole Polytechnique Federale de Lausanne

External person

Fabio Iannello

  • Polytechnic University of Milan

External person

Mehar Ullah

  • Lappeenranta-Lahti University of Technology
  • National University of Sciences and Technology Pakistan
  • University of Engineering and Technology, Peshawar

External person

John Thompson

  • University of Edinburgh

External person

Ömer Bulakci

  • Nokia Siemens Networks

External person

Juan Manuel Mauricio

  • University of Seville

External person

Anthony Ephremides

  • University of Maryland, College Park

External person

Talha Ahmed Khan

  • University of Texas at Austin

External person

David Mazzarese

  • Samsung Electronics

External person

Sandra Roger

  • Polytechnic University of Valencia

External person

Ying-Chang Liang

  • ASTAR, Inst Infocom Res
  • University of Electronic Science and Technology of China

External person

Marco Chiani

  • University of Bologna

External person

Yuqing Du

  • The University of Hong Kong

External person

Mohamad Assaad

  • Université Paris-Saclay

External person

B. Maham

  • School of Electrical and Computer Engineering, College of Engineering, University of Tehran

External person

José Mairton B. Da Silva

  • KTH Royal Institute of Technology

External person

Dusit Niyato

  • Nanyang Technological University

External person

Hironori Fukui

  • Kansai University

External person

Symeon Chatzinotas

  • University of Luxembourg
  • University of Luxembourg

External person

Harun Siljak

  • Trinity College Dublin

External person

Andreas Höglund

  • Ericsson Research

External person

Kazushi Ikeda

  • Kyoto University

External person

Jesus Alonso-Zarate

  • Catalan Telecommunications Technology Centre

External person

M. Zorzi

  • University of Padua

External person

Dick Carrillo

  • Lappeenranta-Lahti University of Technology

External person

Mary Ann Ingram

  • Georgia Institute of Technology

External person

Anupam Nayak

  • Indian Institute of Technology Bombay

External person

Vineet Gala

  • Indian Institute of Technology Bombay

External person

Chuyen T. Nguyen

  • Kyoto University

External person

Omid Semiari

  • University of Colorado Colorado Springs

External person

Georgios Spanoudakis

  • Sphynx Analytics Ltd.

External person

Onur Kaya

  • Isik University

External person

Anca Bucur

  • Philips Research

External person

Pierre Pinson

  • Technical University of Denmark

External person

Goncalo Mendes

  • Lappeenranta-Lahti University of Technology

External person

K. Sivanesan

  • Samsung Electronics Co Ltd

External person

Seong Lyun Kim

  • Yonsei University

External person

Toon A.H.J. Norp

  • Netherlands Organisation for Applied Scientific Research

External person

Enrico Paolini

  • University of Bologna

External person

Xu Chen

  • Karolinska Institutet
  • The University of Hong Kong
  • University of Copenhagen

External person

Michele Zorzi

  • Universita' di Padova

External person

André F. Santos

  • Alcatel-Lucent Bell Labs

External person

Marian Codreanu

  • Linköping University

External person

Tamara Dimitrova

  • Macedonian Academy of Sciences and Arts

External person

Slawomir Stanczak

  • Fraunhofer Heinrich Herz Institute

External person

Yang Liang

  • Life Sciences Institute, National University of Singapore

External person

A. Lee Swindlehurst

  • University of California at Irvine

External person

Nicolò Michelusi

  • Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA

External person

Mirsad Cosovic

  • Schneider Electric Dms Ns, Novi Sad, Serbia

External person

Ivo Kovacevic

  • University of Split

External person

Maja Skiljo

  • University of Split

External person

Pingyi Fan

  • Tsinghua University

External person

Benoit Denis

  • CEA – Leti Minatec

External person

Samad Ali

  • University of Oulu

External person

Omer Bulakci

  • Middle East Technical University

External person

Muhammad Awais Javed

  • COMSATS University Islamabad

External person

Joao Henrique Inacio de Souza

  • State University of Londrina

External person

Rene Guillaume

  • Robert Bosch GmbH

External person

Wei Yang

  • Chalmers University of Technology
  • Tianjin University

External person

Tony Q. S Quek

  • Singapore University of Technology and Design

External person

Vicent Pla

  • Polytechnic University of Valencia

External person

Mischa Dohler

  • Centre Tecnologic de Telecomunicacions de Catalunya
  • King's College London

External person

Anis El Gabli

  • University of Oulu

External person

Mikael Fallgren

  • Ericsson Research

External person

Panagiotis Demestichas

  • University of Piracus

External person

Morteza Banagar

  • University of Tehran

External person

Qobad Shafiee

  • University of Kurdistan

External person

Stefania Sesia

  • Renault Software Lab

External person

Dingzhu Wen

  • The University of Hong Kong

External person

Andrea Munari

  • German Aerospace Center

External person

Plinio Morita

  • University of Waterloo

External person

Liljana Gavrilovska

  • University "Sts. Cyril and Methodius"

External person

Kentaro Nishimori

  • Niigata University

External person

Sabyasachi Gupta

  • University of Alabama

External person

Toshiaki Koike-Akino

  • Mitsubishi Materials Corporation

External person

Yanna Bai

  • Beijing Jiaotong University

External person

Christoph Hausl

  • Technical University of Munich

External person

Kashif Mahmood

  • Telenor
  • Tallinn University of Technology

External person

Daniel Gutierrez-Rojas

  • Lappeenranta-Lahti University of Technology

External person

Fabio Ricciato

  • Universit`a del Salento

External person

Huaping Liu

  • State Key Laboratory of Advanced Optical Communication Systems and Networks, Peking University

External person

Arogyaswami Paulraj

  • Stanford University
  • Dept. of EE, Stanford University, Stanford

External person

Muhammad Zeeshan Shakir

  • University of West of Scotland

External person

Bijaya Ketan Panigrahi

  • Indian Institute of Technology Delhi

External person

Mehdi Zeinali

  • University of Edinburgh

External person

Do-Young Kim

  • Samsung Electronics

External person

Jose F. Monserrat

  • Polytechnic University of Valencia

External person

H. Sakai

  • Kyoto University

External person

Touraj Soleymani

  • KTH Royal Institute of Technology

External person

Richard Demo Souza

  • Londrina State University, Parana, Brazil

External person

Andrea Alù

  • City University of New York

External person

Miguel Angel Vazquez

  • Catalan Telecommunications Technology Centre

External person

Liang Yang

  • Technical University of Denmark

External person

Beatrice Petriarca

  • Aalborg University

External person

Toni Perkovic

  • University of Split

External person

Francisco Helder C. dos Santos Filho

  • Federal University of Ceara

External person

Paolo Castiglione

  • AKG Acoustics GmbH

External person

Danish Khan

  • Aalborg University

External person

Eduard A. Jorswieck

  • TU Braunschweig

External person

Jin-Kyu Koo

  • Samsung Electronics CO., LTD

External person

Tiffany Jing Li

  • Department of Electrical and Computer Engineering, Lehigh University

External person

Boris Manev

  • Vrije Universiteit Amsterdam

External person

Monica Navarro

  • Catalan Telecommunications Technology Centre

External person

Irene Macaluso

  • Trinity College Dublin

External person

Mikhail Ivanov

  • Qamcom Research & Technology AB

External person

M. Kovacevic

  • University of Novi Sad

External person

Maxime Guillaud

  • EURECOM
  • Huawei Technologies Co., Ltd.

External person

Tae-Young Lim

  • Samsung Electronics CO., LTD

External person

Toshiaki Koike Akino

  • Harvard University

External person

Toshiaki Koike Akino

  • Harvard University

External person

Xiaoming Chen

  • Zhejiang University
  • Xi'an Jiaotong University

External person

Imran Shafique Ansari

  • Texas A&M University, Qatar

External person

Bo Ai

  • Peng Cheng Laboratory
  • Zhengzhou University

External person

Benoît Denis

  • Commissariat à l’énergie atomique et aux énergies alternatives

External person

F. Brannstrom

  • Chalmers University of Technology

External person

Huaping Liu

  • Peking University

External person

Jinho Choi

  • Yonsei University

External person

Thinh Q. Dinh

  • University of Information Technology,

External person

Frederik Brännström

  • Chalmers University of Technology

External person

K. Smiljkovikj

  • SS Cyril and Methodius University in Skopje

External person

Lorenzo Valentini

  • University of Bologna

External person

Christopher Boyd

  • Aalto University

External person

I-Hong Hou

  • Department of Electrical and Computer Engineering, Texas A&M University

External person

Zoran Blazevic

  • University of Split

External person

Hiroki Matsushima

  • Kyoto University

External person

Zhengdao Wang

  • Iowa State University

External person

Gang-Yi Wu

  • University of Electronic Science and Technology of China

External person

Ernane Antônio Alves Coelho

  • Universidade Federal de Uberlândia

External person

Wenqian Huang

  • Beihang University

External person

M. Levorato

  • University of Southern California

External person

Florian Leinkeit

  • University of Bremen

External person

Wen Chen

  • Department of Electronic Engineering, Shanghai Jiao Tong University

External person

Konstantinos Fysarakis

  • Sphynx Analytics Ltd.

External person

Floriano De Rango

  • University of Calabria

External person

L. Gavrilovska

  • SS Cyril and Methodius University in Skopje

External person

Zhiyan Liu

  • The University of Hong Kong

External person

Maja Stella

  • University of Split

External person

Peter Larsson

  • Ericsson AB

External person

Philip V. Orlik

  • Mitsubishi Materials Corporation

External person

O. Simone

  • CWiP, Department of Electrical and Computer Engineering, New Jersey Institute of Technology, Newark, NJ, USA

External person

Kentaro Nishimori

  • NTT Corporation

External person

Ruben Lliuyacc

  • University of Seville

External person

Frederik Brännström

  • Chalmers University of Technology

External person

Xiaodai Dong

  • Department of Electrical and Computer Engineering, University of Victoria

External person

Marco Di Renzo

  • Université Paris-Saclay
  • Université Paris-Sud

External person

Khalid A. Qaraqe

  • Texas A&M University, Qatar

External person

Qiang Li

  • Jinan University

External person

Philip Orlik

  • Mitsubishi Materials Corporation

External person

Nandana Rajatheva

  • University of Oulu

External person

K. Hayashi

  • Kyoto University

External person

Andrew Forsyth

  • University of Manchester

External person

Marc M. Gost

  • Polytechnic University of Catalonia

External person

Changhong Zhao

  • The Chinese University of Hong Kong, Shenzhen

External person

Maxime Guillaud

  • Vienna University of Technology

External person

Chaouki Ben Issaid

  • University of Oulu

External person

Zezhong Zhang

  • The University of Hong Kong

External person

Philip Orlik

  • Mitsubishi Materials Corporation

External person

Martijn Rooker

  • TTTech Computertechnik AG

External person

Karl Henrik Johansson

  • KTH Royal Institute of Technology

External person

Jeffrey Andrews

  • University of Texas at Austin

External person

Ferdinando Suriano

  • D.E.I.S., Univ. of Calabria, Rende

External person

Plínio S. Deste

  • Universidade Estadual de Campinas

External person

Amelia Regan

  • University of California at Irvine

External person

Genevieve Mange

  • Alcatel-Lucent

External person

Mats Bengtsson

  • KTH Royal Institute of Technology

External person

Yuanyue Wang

  • Aalborg University

External person

Hugo Tullberg

  • Ericsson Research

External person

Sotiris Ioannidis

  • Institute of Computer Science, Foundation for Research and Technology Hellas (FORTH), Greece
  • Technical University of Crete

External person

Per D. Pedersen

  • Neogrid Technologies ApS

External person

Paulo Cardieri

  • Universidade Estadual de Campinas

External person

Ugo S. Dias

  • University of Brasília

External person

Gerald Fritz

  • TTTech Computertechnik AG

External person

N. Zlatanov

  • University of British Columbia

External person

Sendy Phang

  • University of Nottingham

External person

Tobias Koch

  • Signal Theory and Communications Department, Universidad Carlos III de Madrid, Gregorio Marañón Health Research Institute, Leganés, Madrid, Spain

External person

A. Al-Shuwaili

  • CWiP, Department of Electrical and Computer Engineering, New Jersey Institute of Technology, Newark, NJ, USA

External person

Giovanni Sasso

  • Aalborg University

External person

Bo Zhou

  • State Key Laboratory of Advanced Electromagnetic Engineering and Technology
  • Huazhong University of Science and Technology

External person

Seong-Lyun Kim

  • Yonsei University

External person

Ender Uysal

  • University of Health Sciences
  • Middle East Technical University

External person

Stefano Buzzi

  • Department of Electrical and Information Engineering, University of Cassino
  • Lazio Meridionale

External person

Milutin Pajovic

  • Mitsubishi Materials Corporation

External person

Laurent Hébert-Dufresne

  • University of Vermont

External person

Wali Ullah Khan

  • University of Luxembourg

External person

J. Park

  • Soonchunhyang University

External person

Y.K. Cho

  • Samsung Electronics Co Ltd

External person

Zhendong Peng

  • University of Electronic Science and Technology of China

External person

Giuseppe Araniti

  • University Institute of Architecture of Reggio Calabria

External person

Jorge Martinez-Bauset

  • Polytechnic University of Valencia

External person

Suman Rath

  • Oklahoma State University

External person

Toshiaki Koike-Akino

  • Harvard University

External person

Garcia Ordonez Luis

  • Univ Politecn Cataluna, E-08028 Barcelona, Spain

External person

Behrouz Maham

  • University of Tehran

External person

Seyyed Mohammadreza Azimi

  • New Jersey Institute of Technology

External person

Stephanie Mayer

  • University of St. Gallen

External person

Sameh Hosny

  • Wireless Intelligent Networks Center, Nile university

External person

Constantinos B. Papadias

  • Athens Information Technology

External person

Olav Tirkkonen

  • Aalto University

External person

Mohammed Nafie

  • Wireless Intelligent Networks Center, Nile university

External person

Riku Jantti

  • Aalborg University

External person

Daniel Benevides da Costa

  • Technology Innovation Institute (TII)

External person