Amir Sajjad Bahman

Ph.D. in Energy Technology

  • Pontoppidanstræde 101, 3-014

    9220 Aalborg Ø

    Denmark

20132023
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Insulated gate bipolar transistors (IGBT) Engineering & Materials Science
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Thermal stress Engineering & Materials Science
Finite element method Engineering & Materials Science
Switches Engineering & Materials Science
Temperature distribution Engineering & Materials Science
Electric fuses Engineering & Materials Science
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Projects 2017 2023

Power electronics
Variable speed drives
Electronics industry
Testing
Product design
liquid cooling
quadrants
cooling systems
cooling
optimization

Research Output 2013 2019

10 Downloads (Pure)

Frozen Leg Operation of a Three-Phase Dual Active Bridge Converter

Haghbin, S., Blaabjerg, F. & Bahman, A. S., May 2019, In : IEEE Transactions on Power Electronics. 34, 5, p. 4239 - 4248 10 p.

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File
Diodes
Electric potential
Switches
Topology
Hardware
1 Citation (Scopus)
14 Downloads (Pure)

Mission-Profile-Based Lifetime Prediction for a SiC mosfet Power Module Using a Multi-Step Condition-Mapping Simulation Strategy

Ceccarelli, L., Kotecha, R. M., Bahman, A. S., Iannuzzo, F. & Mantooth, H. A., Oct 2019, In : IEEE Transactions on Power Electronics. 34, 10, p. 9698-9708 11 p., 8616890.

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File
Topology
Power converters
Reliability analysis
Specifications
Finite element method
24 Citations (Scopus)
663 Downloads (Pure)

A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High Power IGBT Modules

Bahman, A. S., Ma, K. & Blaabjerg, F., Mar 2018, In : I E E E Transactions on Power Electronics. 33, 3, p. 2518 - 2530 13 p.

Research output: Contribution to journalJournal articleResearchpeer-review

Open Access
File
Insulated gate bipolar transistors (IGBT)
Boundary conditions
Power electronics
Finite element method
Hot Temperature

A Multi-Layer RC Thermal Model for Power Modules Adaptable to Different Operating Conditions and Aging

Akbari, M., Bahman, A. S., Tavakoli Bina, M., Eskandari, B., Iannuzzo, F. & Blaabjerg, F., 30 Oct 2018, Proceedings of 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe). IEEE, p. 1-10 10 p. 8515416

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

Open Access
File
Aging of materials
Thermal aging
Hot Temperature
Circuit simulation
Insulated gate bipolar transistors (IGBT)
4 Downloads (Pure)

Computer-aided engineering simulations

Bahman, A. S. & Iannuzzo, F., Jun 2018, Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. Suganuma, K. (ed.). Woodhead Publishing, p. 199 - 223 25 p. (Elsevier).

Research output: Contribution to book/anthology/report/conference proceedingBook chapterResearchpeer-review

Computer aided engineering
Energy gap
Industry
Power semiconductor devices