Amir Sajjad Bahman

Ph.D. in Energy Technology

  • Pontoppidanstræde 101, 3-014

    9220 Aalborg Ø

    Denmark

20132023
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  • 5 Similar Profiles
Insulated gate bipolar transistors (IGBT) Engineering & Materials Science
Thermal stress Engineering & Materials Science
Power electronics Engineering & Materials Science
Finite element method Engineering & Materials Science
Wire Engineering & Materials Science
Switches Engineering & Materials Science
Reliability analysis Engineering & Materials Science
Temperature distribution Engineering & Materials Science

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Projects 2017 2023

Power electronics
Variable speed drives
Electronics industry
Testing
Product design
liquid cooling
quadrants
cooling systems
cooling
optimization

Research Output 2013 2020

Compact Sandwiched Press-Pack SiC Power Module with Low Stray Inductance and Balanced Thermal Stress

Chang, Y., Luo, H., Iannuzzo, F., Bahman, A. S., Li, W., He, X. & Blaabjerg, F., Mar 2020, In : IEEE Transactions on Power Electronics . 35, 3, p. 2237 - 2241 5 p.

Research output: Contribution to journalJournal articleResearchpeer-review

Thermal stress
Inductance
Busbars
Heat resistance
Cooling

A Busbar Integrated SiC-based Converter with Embedded Heat-pipes

Chang, Y., Bahman, A. S., Luo, H., Li, W., He, X., Iannuzzo, F. & Blaabjerg, F., May 2019, Proceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia). IEEE Press, p. 2166-2172 7 p. 8796953. (International Conference on Power Electronics).

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

Busbars
Heat pipes
Packaging
Temperature control
Thermal stress

A Methodology for Rapid Estimation of Junction Temperature of Power Semiconductors Considering Mission Profiles

Alavi, O. & Bahman, A. S., Jun 2019, Proceedings of 2019 IEEE 28th International Symposium on Industrial Electronics (ISIE). IEEE Press, p. 2359-2364 6 p. 8781177. (Industrial Electronics (ISIE), IEEE International Symposium on).

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

Semiconductor materials
Temperature
Table lookup
Energy conversion
Wind power

A Review: New Designs of Heat Sinks for Flow Boiling Cooling

Nujukambari, A. Y., Bahman, A. S., Hærvig, J. & Sørensen, H., Sep 2019, Proceedings of 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, 6 p. (International Workshop on Thermal Investigations of ICs and Systems).

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

Heat sinks
Boiling liquids
Cooling
Microchannels
Coolants

Enhancement of Thermo-mechanical Behavior of IGBT Modules through Engineered Threshold Voltages

Akbari, M., Reigosa, P. D., Bahman, A. S., Ceccarelli, L., Iannuzzo, F. & Bina, M. T., Sep 2019, Proceedings of 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). IEEE Press, 9 p.

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

Insulated gate bipolar transistors (IGBT)
Threshold voltage
Temperature distribution
Current density
Finite element method